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Computer system with heat radiation modules of mounting multiple pumps

A computer system and heat dissipation module technology, applied in the field of computer systems, can solve problems such as coolant circulation, processor 14 circuit burnout, processor 14 heat energy cannot be eliminated, etc., and achieve the effect of speeding up the speed

Inactive Publication Date: 2006-05-17
MICRO-STAR INTERNATIONAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, if the pump 24 breaks down, the coolant cannot circulate smoothly in the water tank 26 and the heat pipe 22, and the heat energy generated by the processor 14 cannot be eliminated. As a result, the function of the water-cooled heat dissipation module 12 cannot Volatilize, and then cause the circuit of the processor 14 to burn out, and finally cause the shutdown of the entire computer system 10
Especially now that the operating frequency of the processor 14 is getting higher and higher, and the heat energy generated is also increasing. Once the water-cooled heat dissipation module 12 fails to operate, the processor 14 may be burned in just a few seconds, causing the user to There is simply not enough time to react

Method used

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  • Computer system with heat radiation modules of mounting multiple pumps
  • Computer system with heat radiation modules of mounting multiple pumps
  • Computer system with heat radiation modules of mounting multiple pumps

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Experimental program
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Embodiment Construction

[0011] Firstly, the accompanying symbols in the present invention are explained: 10, 30 computer system, 12, 32 cooling module, 14, 34 processor, 16, 36 memory, 22, 42 heat pipe, 24, 48 pump, 26, 46, 46a, 46b water tank, 38 detection device, 44 cooling device, 50 logic unit, 52 opening, 54 water inlet hole, 56 water outlet hole.

[0012] see figure 2 , figure 2 is a schematic diagram of the computer system 30 of the present invention. The computer system 30 includes a processor 34 , a memory 36 , a cooling module 32 and a detector 38 . The processor 34 is used to process programs and data, the memory 36 is used to store programs and data, and the heat dissipation module 32 is used to dissipate the heat energy generated by the processor 34. The heat dissipation module 32 includes a heat pipe 42 and a cooling device 44, and the heat pipe 42 A portion of the section is adjacent to the processor 34 for conducting thermal energy. The cooling device 44 includes a plurality of ...

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Abstract

A computer system includes a processor, a memory and a cooling module. The processor is used to process programs and data, the memory is used to store programs and data, the cooling module is used to dissipate the heat generated by the processor, and the cooling module includes a heat pipe adjacent to the processor for conducting heat ; and a cooling device. The cooling device includes a plurality of connected water tanks, a plurality of pumps and a logic unit. The first water tank and the last water tank in the plurality of water tanks are connected to the heat pipe to form a closed loop. When any pump stops running, the logic unit will control the other pumps to speed up to maintain the flow rate of coolant circulating in the heat pipe.

Description

technical field [0001] The invention provides a computer system, especially a computer system with a cooling module installed with multiple pumps. Background technique [0002] With the rapid development of science and technology, the speed of development of today's electronic devices such as computers and servers is also increasing day by day, especially the speed of progress in processors is astonishing. As the operating frequency of the processor is getting faster and faster, the heat generated by it is getting higher and higher. In order to maintain the processor of the electronic device in a high-frequency working environment with a limited volume This problem has become a bottleneck that urgently needs to be overcome today. [0003] Although there are many different heat dissipation methods on the market, the existing heat dissipation technology can no longer solve the heat generated by the processor and various components, so the application of many heat dissipation ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
Inventor 张弘
Owner MICRO-STAR INTERNATIONAL