Electronic component mounting device

Abstract

An electronic component mounting apparatus improves the quality of a substrate on which electronic components are mounted according to a state change of an electronic component held by a suction nozzle. In the electronic component mounting apparatus (1), after the suction nozzle (6a) holds the electronic component (D), at a plurality of timings while the loading head (6) having the suction nozzle (6a) moves relative to the substrate (P) , compare the postures of the electronic components (D) in multiple timings detected by the laser recognition unit (5), and obtain component comparison data related to the different postures of these electronic components (D), and compare the component comparison data Compare with predetermined benchmark value. When the control unit (10) as the judging unit judges that the component comparison data is greater than or equal to the reference value, the displacement of the electronic component (D) held by the suction nozzle (6a) is large, and it is often loaded on the substrate (P ) on the board (P), a failure occurs, so the operation of loading the electronic component (D) held by the suction nozzle (6a) on the substrate (P) is stopped.

Description

technical field [0001] The present invention relates to an electronic component mounting device. Background technique [0002] Conventionally, an electronic component mounting apparatus is known as an apparatus for mounting electronic components on a substrate. The electronic component mounting apparatus sucks and holds a plurality of electronic components supplied from a component supply unit by using a suction nozzle provided on a loading head. Transfer to base plate for loading and installation. [0003] In such an electronic component mounting apparatus, after the suction nozzle sucks and holds the electronic component from the component supply unit, and in order to mount the electronic component on the substrate, the mounting head having the suction nozzle holding the electronic component moves relative to the substrate. At each timing of , the presence or absence of an electronic component held by the tip of the suction nozzle is detected. In addition, an electronic ...

AI Technical Summary

Problems solved by technology

However, data related to electronic components in each measurement timing is not correlated

[0007] That is, the data related to the electronic component acquired at the timing at which the suction nozzle sucks and holds the electronic component and the timing at which the mounting head having the suction nozzle holding the electronic component moves with respect to the substrate after that is not correlated, there is no Detects state changes such as the posture of the electronic component held by the suction nozzle during the process (the process in which the loading head with the suction nozzle moves after the suction nozzle suctions and holds the electronic component)

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