Cleaning clamp for wafer carrying bench of semiconductor machine

Abstract

This invention relates to semiconductor crystal load bench clearing clamper, which comprises one body part, one drive device, one power supply device and one clearing module composed of one rotation base, one spring element and one clear rotation disc, wherein, the body part can be adjusted length with one capacity space located in the space to provide one power; the power supply device is coupled to the drive device to provide drive device electricity source; the rotation socket is set near to drive device through spring element connected with clearing disc by drive device to provide power to make the disc clean semiconductor mixtures.

Description

technical field [0001] The invention relates to a wafer carrier cleaning jig of a semiconductor machine, in particular to a freely retractable cleaning jig used for cleaning the wafer carrier of a semiconductor machine. Background technique [0002] When there are impurities (Particles) on the Wafer Stage of the exposure machine, it will cause the wafer to be out of focus (Defocus). At this time, the machine must stop production immediately to remove the impurities on the wafer stage. [0003] The current commonly used method is to use a dust-free cloth dipped in alcohol to wipe the wafer stage, and use the manual method of lighting with a flashlight. However, due to the 12-inch semiconductor machine currently used, there are many precision components near the wafer stage, and The space available for wiping is very low, coupled with the deep depth of the wafer stage, it often causes trouble when the wiper wipes the wafer stage, and even if the wiper is very careful, there is...

AI Technical Summary

Problems solved by technology

[0005] 1. In the current cleaning method of the wafer carrier, because the semiconductor machine has a very low space for wiping, and the depth of the wafer carrier is deep, it is easy to have dead spots that are not easy to clean.

[0006] 2. The existing wafer stage cleaning methods often increase the complexity and difficulty of cleaning due to insufficient lighting, thereby reducing the cleaning quality and affecting the yield of subsequent wafer manufacturing processes

[0007] 3. The existing wafer carrier cleaning method, due to the manual wiping method, encounters highly viscous impurities, which are difficult to remove and affect the yield of the subsequent wafer manufacturing process.

[0008] 4. The existing wafer carrier cleaning method cannot quickly remove impurities when encountering precision components next to the wafer carrier, and it is easy to cause damage to the machine if you are not careful

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