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Component handling device having a film insert molded RFID tag

A technology of RFID tags and films, applied to computer parts, record carriers used by machines, instruments, etc., can solve problems such as increasing manufacturing costs, endangering processor functions and appearance, and complexity of additional components

Inactive Publication Date: 2006-06-21
ENTEGRIS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this conventional technique of placing an RFID tag on such a processor typically requires additional thermal polymer material and altered processor device design, thereby increasing manufacturing costs and introducing additional components that potentially compromise processor functionality and aesthetics Complexity

Method used

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  • Component handling device having a film insert molded RFID tag
  • Component handling device having a film insert molded RFID tag
  • Component handling device having a film insert molded RFID tag

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0028] Referring to Figures 1-8, the present invention comprises an insert molded RFID tag film sheet 10 which utilizes a molding unit 20 to place an RFID tag 11 enclosed therein on a selected target surface of a sensitive component handling device.

[0029] RFID label lamination

[0030] Referring primarily to Figures 1-5c, an RFID label laminate 10 generally includes two thin flexible thermoplastic polymer film layers 10a, 10b and an RFID label 11 . The membrane generally comprises at least two membranes 10a, 10b at least partially bounded by defined grade thicknesses. For example, in one embodiment, a single layer of film having a thickness of equal to or less than about 0.40 inches (ten thousandths) is contemplated. In other embodiments, the films 10a, 10b may be less than or equal to about 0.20 inches (twenty thousandths). In still other embodiments, one or both of the film layers 10a, 10b may be constructed or formed from a multi-layer film laminate. Of course, the re...

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PUM

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Abstract

A system and method comprising thin, flexible RFID tags in the molding process of handlers, conveyors, carriers, trays, etc. handling devices used in the semiconductor and sensitive electronic component processing and handling industries. An RFID tag of a predetermined size and shape is typically glued or encapsulated between two thermopolymer film layers to create an RFID tag laminate. The RFID tag laminate is optionally positioned along the forming surface in the molding cavity so as to be aligned with the desired target surface of the moldable molten resin material, thereby completing the film insert molding process, the RFID tag laminate integrally bonded at least Parts of the molded handling device or handling device elements / parts.

Description

[0001] related application [0002] This application claims priority to U.S. Provisional Application No. 60 / 469,158, filed May 9, 2003, entitled "Component Handling Apparatus Having Thin Film Insert Molded RFID Tags," the entire contents of which are incorporated herein by reference refer to. technical field [0003] The present invention relates generally to thin film insert molding, and more particularly to insert molding a thin flexible radio frequency identification (RFID) tag laminate, during component handling device molding. Background technique [0004] The generally conventional film insert molding technique is utilized in the manufacturing process to increase the aesthetic appeal of various consumer products. That is, decorative decals, introductions, logos, and other visual graphics are printed on one surface of a thin transparent polymer film used in the insert molding process. In these cases, the above-mentioned film is placed in a part of the mold before inje...

Claims

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Application Information

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IPC IPC(8): G06K19/06
Inventor 韦恩·阿斯坡
Owner ENTEGRIS INC