Cooler for electronic equipment
A technology for electronic equipment and cooling devices, applied in cooling/ventilation/heating transformation, electrical digital data processing, instruments, etc., can solve problems such as low cooling efficiency, inability to make cooling devices thinner, and inability to fully ensure heat dissipation area, etc., to achieve Sufficient cooling area and high cooling efficiency
Inactive Publication Date: 2006-08-02
NEC CORP
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Problems solved by technology
[0007] In the prior art described in the above-mentioned gazette, since the coolant is circulated in the pipe disposed at the bottom of the personal computer body, it is not possible to ensure a sufficient heat dissipation area, the cooling efficiency is low, and the cooling device cannot be thin. the problem of
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[0042] Hereinafter, based on the embodiment of the present invention, the present invention will be described in more detail with reference to the drawings. In addition, the same code|symbol is attached|subjected to the same component according to drawing.
[0043]If refer to figure 1 , then the cooling device for electronic equipment in the first embodiment has: a first cooling plate 1; a second cooling plate 2; connecting the first cooling plate 1 and the second cooling plate 2, with the first cooling plate 1 opposite 2 cooling plates 2, along with figure 1 The direction shown by the arrow in (c) is used as the connecting parts 61, 62 which are pivotally supported and can be freely opened and closed.
[0044] The cooling device has a function of cooling the CPU and other heating elements that generate heat by circulating coolant such as water and antifreeze through the passages formed in the first cooling plate 1 and the second cooling plate 2 . Thermal components7. figu...
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The present invention provides a thin cooler for electronic equipment, having a large heat radiation area and preventing leakage of a refrigerant. A cooler has a first and a second cooling panel (1, 2) respectively having flow paths (11, 21) formed by joining a lower heat radiation plate and an upper heat radiation plate, the plates having groove portions formed in them, and a circulation pump (3) for circulating a refrigerant in the flow paths (11, 21). In the upper heat radiation plate of the second cooling panel (2) are formed an outflow opening from which the refrigerant flows out from the flow path (21) toward the circulation pump (3) and an inflow opening from which the refrigerant flows in from the circulation pump (3) toward the flow path (21). The circulation pump (3) is fixed to the upper heat radiation plate of the cooling panel (2) such that a suction port and a discharge port are aligned with the outflow opening and the inflow opening, respectively.
Description
technical field [0001] The present invention relates to a cooling device for electronic equipment, and more particularly to a cooling device for electronic equipment suitable for cooling heat-radiating components such as a CPU mounted in a notebook personal computer or the like. Background technique [0002] In recent years, electronic devices such as personal computers have been equipped with heat-dissipating components such as CPUs that consume a large amount of power due to the increase in the amount of calculation processing and the increase in speed, and the heat generated by the above-mentioned heat-dissipating components has been increasing. Various electronic components used in these electronic devices start from the temperature dependence of heat resistance reliability and operating characteristics, because the operating temperature range is usually limited, so in these electronic devices, the heat generated inside It is imperative to establish a technology to effic...
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IPC IPC(8): G06F1/20H05K7/20
CPCG06F1/203G06F2200/201
Inventor 三洼和幸北城荣越智笃山本满
Owner NEC CORP