Process for manufacturing a solar cell foil using a temporary substrate
A technology of solar cells and temporary substrates, applied in the direction of final product manufacturing, sustainable manufacturing/processing, circuits, etc., can solve problems such as short circuits
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no. 3 example
[0066] A third embodiment of the method according to the invention comprises the following steps:
[0067] provide an etchable temporary substrate;
[0068] applying a transparent conductive oxide (TCO) front electrode on said temporary substrate;
[0069] applying a photovoltaic layer (PV layer) on said TCO layer and providing grooves through said PV layer up to said TCO layer or through said TCO layer up to said temporary substrate;
[0070] A back electrode layer is applied on the PV layer and in the groove in such a way that the back electrode is interconnected to the front electrode inside the groove, while the The back electrodes are electrically insulated from each other;
[0071] apply a permanent carrier;
[0072] In any one of the above steps, providing a resist on the non-TCO side of the temporary substrate at the interconnect location;
[0073] selectively removing said temporary substrate not covered with resist; and
[0074] Grooves are provided through the ...
no. 4 example
[0077] A fourth embodiment of the present invention includes the following steps:
[0078] provide an etchable temporary substrate;
[0079] applying a transparent conductive oxide (TCO) front electrode on said temporary substrate;
[0080]Applying a photovoltaic layer (PV layer) on the TCO and providing grooves through the PV layer and the TCO up to the temporary substrate, filling the grooves with insulating material, optionally applying a cap at the same time , and, if necessary, apply insulating strips and pass through the PV layer until the TCO establishes a conductive connection (precursor);
[0081] applying a back electrode on said PV layer;
[0082] grooves are provided in the back electrode up to the PV layer, or if present, up to the insulating strip;
[0083] Optionally apply a permanent carrier;
[0084] In any of the above steps, providing a resist on the non-TCO side of the temporary substrate at the interconnect location; and
[0085] The temporary substra...
no. 5 example
[0088] A fifth embodiment of the present invention includes the following steps:
[0089] a. Provide a temporary substrate;
[0090] b. Applying a transparent conductive oxide (TCO);
[0091] c. Applying a photovoltaic layer (PV layer) on said TCO;
[0092] d. Applying one or two insulating strips on the PV layer, if required;
[0093] e. applying a backside electrode on said PV layer and, if present, on said insulating strip;
[0094] f. Repairing a shunt in said backside electrode, if necessary, if an interconnection has not been established;
[0095] g. applying grooves in the back electrode up to the PV layer, or if present, up to the insulating strip;
[0096] h. Apply a permanent carrier if desired;
[0097] i. In any one of the above steps, applying a resist on the non-TCO side of the temporary substrate at the location of the interconnects;
[0098] j. selectively removing said temporary substrate not covered with resist;
[0099] k. providing grooves from the T...
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