Ultrasonic connection head and device employing same

A bonding device and ultrasonic technology, applied in the direction of vibrating fluid, non-electric welding equipment, electrical components, etc., can solve the problems of screw looseness and damage, and achieve the effect of easy maintenance and low-cost structure

Inactive Publication Date: 2006-09-06
TORAY ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As a result, there is a problem that the tightened screw becomes loose, or is damaged due to metal fatigue

Method used

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  • Ultrasonic connection head and device employing same
  • Ultrasonic connection head and device employing same
  • Ultrasonic connection head and device employing same

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0043] Hereinafter, an embodiment of an ultrasonic bonding apparatus having an ultrasonic bonding head according to the present invention will be described with reference to the drawings.

[0044] In addition, in this embodiment, the case where the electronic component with a bump which is a chip component is mounted on a board|substrate is demonstrated as an example. In addition, other chip components include IC chips, semiconductor chips, optical elements, surface mount components, etc., and represent all forms on the side bonded to the substrate regardless of the type and size of the wafer or the like.

[0045] In addition, as a board|substrate, a resin board|substrate, a glass board|substrate, a film board|substrate etc. are mentioned, for example, and it shows all forms of the side bonded to a chip component.

[0046] figure 1 It is a front view of the key acoustic wave bonding apparatus related to this embodiment.

[0047] The ultrasonic bonding device of this embodime...

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PUM

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Abstract

The invention discloses a supersonic wave bonding head and the device applying said bonding head; the center of front part of energy-transferring device is negative element, the adsorption component is placed in the center of said negative element and is provided with an adsorption area projective from front part of energy transferring device that is projective part. The lower part of adsorption component is equipped with a side surface facing the bottom surface of negative element and widened in cone shape; the slant face of side surface contacts with holding element; and the side surface is cramped by fastening the holding element and said negative element.

Description

technical field [0001] The present invention relates to an ultrasonic bonding (bonding) head and a device using an ultrasonic bonding head. This bonding head is used for pressing or pressing and heating electrodes of chip components such as electronic components and workpiece electrodes such as substrates on one side. 1. Ultrasonic vibration is applied to the bonded part on one side to perform ultrasonic bonding. Background technique [0002] When using the conventional method to bond the electrodes of chip components such as electronic components to the electrodes of the base, the electrodes of the chip components and the electrodes of the substrate are pressed, and ultrasonic vibration is applied to the bonded part. . This ultrasonic bonding head for ultrasonic bonding includes a sonotrode that generates ultrasonic vibrations, a transducer (horn) that transmits the generated ultrasonic vibrations, and an indenter that is an adsorption member that adsorbs and holds chip co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K20/10B06B1/00B06B3/00H01L21/607
Inventor 今井宏一上西孝史
Owner TORAY ENG CO LTD
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