Cross feed broadband omnidirectional antenna

Abstract

The invention relates to a cross feed wideband omnidirectional aerial, which uses dual-surface copper print to form upper aerial unit and lower aerial unit on the microwave medium plate, wherein the upper and lower aerial units have metallic through holes; the upper aerial unit is formed by connecting wire, radiation unit A, and radiation unit B; the connecting wire has feed port; the lower aerial unit is formed by connecting wire, radiation unit A, and radiation unit B; the connecting wire has feed port; the radiation units A upper and lower aerial units form the symmetry vibrator aerial radiation device A with load capacitance; the radiation units B of upper and lower aerial units form the symmetry vibrator aerial radiation device B with load capacitance; the connecting wires of upper and lower aerial units form the parallel wide couple dual wires with cross feed electricity to the symmetry vibrator aerial devices (A, B).

Description

technical field [0001] The invention relates to an antenna printed on a dielectric board, more particularly, to a cross-fed broadband omnidirectional antenna with a capacitive load radiation unit. Background technique [0002] Printed antenna has unique advantages such as low profile, easy processing, low cost, and can be integrated with active devices, so it has a wide range of applications and has aroused great interest. The research on printed antennas has developed rapidly and has become an important research direction in the field of antennas. [0003] The common disadvantage of printed antennas is their narrow bandwidth, which limits their application in broadband situations. How to broaden the bandwidth is an important research content. Currently proposed technologies include thickening the substrate or using a thick air medium; using the relative permittivity ε r Substrates with small or large loss tangent tanδ, capacitive feeding (impedance matching); wedge-shaped...

AI Technical Summary

Problems solved by technology

These technologies often have defects in some aspects or have limited frequency band expansion effects. For example, the use of thick substrates is easy to excite surface waves; the addition of passive patches and the use of multi-layer ...

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