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Integrated circuit package with glass layer and oscillator

A technology of integrated circuits and glass layers, applied in circuits, electrical components, electrical solid-state devices, etc., can solve the problems of large size, increased cost and fragility, and fragility

Inactive Publication Date: 2010-06-16
MARVELL WORLD TRADE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, crystal oscillators have several inherent disadvantages, including bulkiness, fragility and high cost
Also, the size and cost of crystal oscillators are related to the resonant frequency such that as frequency increases size decreases while cost and fragility can increase rapidly

Method used

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  • Integrated circuit package with glass layer and oscillator
  • Integrated circuit package with glass layer and oscillator
  • Integrated circuit package with glass layer and oscillator

Examples

Experimental program
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Embodiment Construction

[0058] figure 1 One aspect of a crystal oscillator emulator 10 for generating an output signal 12 with a precise frequency is shown. The crystal oscillator emulator 10 can be built on a single semiconductor die using any process, including a complementary metal oxide semiconductor (CMOS) process.

[0059] Crystal oscillator emulator 10 may include a semiconductor oscillator 14 for generating output signal 12 . Any type of semiconductor oscillator can be used, including LC oscillators, RC oscillators, and ring oscillators. The semiconductor oscillator 14 includes a control input 16 for varying the frequency of the output signal. The control input 16 may be any electrical input affecting a controlled change in the frequency of the output signal, such as the supply voltage of the ring oscillator and the voltage input to the varactor diode of the LC oscillator.

[0060] The non-volatile memory 18 includes calibration information 20 used to control the output signal frequency as...

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PUM

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Abstract

An integrated circuit (IC) package comprises an IC wafer and an annealed glass paste (AGP) layer that is arranged adjacent to the IC wafer. A molding material encapsulates at least part of the IC wafer and the AGP layer. The AGP layer is arranged on at least one side of the IC wafer. The AGP layer is arranged on a plurality of disjoint areas on at least one side of the IC wafer. A layer of a conductive material is arranged on a portion of the AGP layer.

Description

technical field [0001] The present invention relates to integrated circuits, and more particularly, to integrated circuits with annealed glass paste disposed on silicon wafers. Background technique [0002] Accurate frequency references are required in many types of electronic equipment, such as cellular telephones and other handheld devices. Crystal oscillators are often used to provide precise frequency references in these electronic devices. However, crystal oscillators have several inherent disadvantages, including bulkiness, fragility, and high cost. In addition, the size and cost of crystal oscillators are related to the resonant frequency, such that as frequency increases, size decreases while cost and fragility can increase rapidly. As the size of electronic devices continues to decrease, the use of crystal oscillators is becoming more and more problematic due to their size, fragility and cost constraints. [0003] Semiconductor oscillators are a poor alternative ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/29H01L23/31H03B1/00
CPCH01L2924/0002
Inventor 塞哈特·苏塔迪嘉
Owner MARVELL WORLD TRADE LTD