Module detecting card

Abstract

The invention is concerning a kind of module and probe into card, mainly including more than a level PC boards, one interface plank and on probing into a head, that the PC board have plural the first and connect mat, the interface's plank establishes PC board in that with should probe into a head of, the interface's plank includes one basic plank and plural spring coil crest needle, the basic plank has a the first surface, a the second surface and plural master bore, those some run-through bores pierce through should the first surface and should the second surface, those some needles combining those is some run-through bores in the basic knothole, the each spring coil crest needle has a the first contact carry, a the second contact carry and one spring coil, should some the first contact carry flexibility bulge should the first surface, get in touch with those some firsts and connect mat in order to, can resolve the know-how PC board connects mat of the total flat surface error margin cause with know-how interface knothole convex piece point of contact creation the electricity lead and connect a bad problem.

Description

technical field [0001] The invention relates to a test fixture for an integrated circuit, in particular to a module probe card with a new structure. Background technique [0002] In the manufacturing process of integrated circuits, a plurality of chips (that is, chips, hereinafter referred to as chips) must form integrated circuits on a semiconductor wafer, and then be packaged after being singulated and cut into individual chips. Multiple tests are carried out to ensure its function and performance. Generally speaking, the test of a single wafer before the wafer is cut is called wafer inspection or probe test. As the design of the wafer becomes more and more complex, wafer inspection or probe test can determine the The level of yield has become a key part of the entire integrated circuit manufacturing process. The test head of the test equipment used to test the wafer is usually equipped with a probe card as a transmission interface between the test equipment and the wafe...

AI Technical Summary

Problems solved by technology

[0007] The main purpose of the present invention is to overcome the defects of the existing module detection card and provide a new structure of the module detection card. The technical problem to be solved is to make it possible to solve the existing known module detection card The problem of electrical connection failure occurs when using a conventionally used interface board with exposed probes or bumps, so it is more suitable for practical use

[0008] Another object of the present invention is to provide a modular probe card with a new structure. The technical problem to be solved is to make it possible to overcome the poor coplanarity between the existing known interface board and the known probe head. The problem of electrical conduction, so it is more suitable for practical use

Images