Unlock instant, AI-driven research and patent intelligence for your innovation.

Negative pressure type heat radiating device

A heat dissipation device and heat dissipation fin technology, which can be used in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., and can solve problems that do not conform to the development trend of light, thin, short and small hosts, noise interference, etc.

Inactive Publication Date: 2007-07-04
GIGA BYTE TECH CO LTD
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the method adopted in the prior art, the fan is configured to blow on the cooling fins to take away the waste heat. At this time, the effect of heat dissipation depends on the size and speed of the fan and the size of the matching cooling fins. To increase the cooling effect , it is necessary to increase the size of the fan blades and the speed of the fan. Although the waste heat can be eliminated, the sound of the fan rotation and the wind cutting sound generated when the airflow blows over the surface of the cooling fins become serious noise interference; in addition, excessive fan rotation The power consumed during the operation does not meet the current development trend of thin, light and small hosts.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Negative pressure type heat radiating device
  • Negative pressure type heat radiating device
  • Negative pressure type heat radiating device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] The present invention utilizes the configuration of the heat dissipation component to generate a suction negative pressure when the fan rotates, and sucks the cooling air flow from the outside to the heat dissipation fins for heat dissipation. When the waste heat is transferred from the heat absorption component to the heat dissipation fins, the waste heat can pass through this The configuration achieves quietness and high-efficiency heat dissipation. In addition, with the heat dissipation device provided by the present invention, the location of the fan arrangement can take into account the heat dissipation effect of the surrounding electronic components.

[0050] Please refer to FIG. 2 , which is a schematic diagram of a heat dissipation assembly according to the present invention. The heat dissipation component 20 is formed by stacking a plurality of heat dissipation fins 21 , and each of the heat dissipation fins 21 has a through hole 22 to form a channel of the hea...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This invention provides a cooling device, including endothermic component, cooling component and fans, and through the relative position of the cooling component and the fans, when the fans rotating, generating a negative wind suction pressure, making the inflow flowing from the cooling component, and outflow from the fans, to radiate the received heat of the cooling component.

Description

technical field [0001] The invention relates to a cooling device, in particular to a negative pressure cooling device. Background technique [0002] With the increasing demand for computing power of personal computers, many important components such as central processing unit (CPU) or graphics processing unit (GPU) continue to increase the density of transistors. Although the performance is improved, the operation process also generates a lot of heat energy. For the integrated circuit chips of most electronic products, the generation of heat source will not only affect the operating performance of the electronic chip, but also the service life of the chip will be greatly reduced if it is in an environment of excessively high operating temperature for a long time. [0003] The heat dissipation system currently used by electronic components can adopt the following different methods: passive convection directly operating on the heat-producing components of the electronic devic...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/467H01L23/36H01L23/34G06F1/20H05K7/20
Inventor 施博仁林志宪
Owner GIGA BYTE TECH CO LTD