Heat dissipation type semiconductor package structure and its manufacturing method
A packaging structure and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems that affect product reliability, delamination, and poor appearance of finished products
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no. 1 example
[0044] see Figure 2A to Figure 2D , is a schematic cross-sectional view of the first embodiment of the manufacturing method of the heat-dissipating semiconductor package structure of the present invention.
[0045] Such as Figure 2A As shown, a chip carrier 21 such as a substrate is provided, so as to mount and electrically connect at least one semiconductor chip 22 on the chip carrier 21 .
[0046] Besides the illustrated substrate, the chip carrier 21 can also be a lead frame. The semiconductor chip 22 can be electrically connected to the chip carrier 21 by wire bonding as shown in the figure, or can be electrically connected to the chip carrier 21 by flip-chip.
[0047] Such as Figure 2B to Figure 2C As shown, a heat sink 23 with a first surface 231 and a second surface 232 is provided, and the heat sink 23 also includes a flat portion 233 and a support portion 234 extending downward from the flat portion 233, the first heat sink 23 The two surfaces 232 are blackened...
no. 2 example
[0054] see also image 3 , is a schematic diagram of the second embodiment of the heat-dissipating semiconductor package structure and its manufacturing method of the present invention, wherein for the sake of simplification of the drawings and ease of understanding, elements corresponding to the same or similar elements as those in the preceding embodiments are denoted by the same numbers.
[0055] The structure of the heat dissipation semiconductor package of this embodiment is substantially the same as that of the previous embodiment, the main difference is that the heat dissipation element 23 also includes a plurality of through holes 235 for penetrating through the first surface 231 and the second surface 232 of the heat dissipation element 23, and When coating the protective layer 25 , it is necessary to avoid the through hole 235 of the heat sink 23 , and the encapsulant 26 flows into the through hole 235 and hardens and fixes, so as to disperse the stress on the heat si...
no. 3 example
[0057] see also Figure 4A to Figure 4E , is a schematic bottom view of the heat dissipation element of the third embodiment of the heat dissipation semiconductor package structure and its manufacturing method of the present invention, wherein for the sake of simplification of the drawings and ease of understanding, the elements corresponding to the same or similar elements as those in the previous embodiment are denoted by the same numbers.
[0058] The structure of the heat dissipation semiconductor package of this embodiment is substantially the same as that of the preceding embodiments, the main difference is that the protective layer 25 is formed in an opening 251 for exposing part of the blackened layer 24, that is, the protective layer 25 is formed on the opening 251. Around the flat portion 233 of the heat sink 23 , the shape of the opening 251 can be a circle, a square, a rhombus, and the like.
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