Method for cleaning dry film pressed on wafer
A wafer and process technology, applied in the cleaning process field, can solve problems such as inaccurate exposure and affecting exposure quality, and achieve the effect of improving quality
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0013] The method for using the dry film of the present invention is applicable to the wafer-level packaging process, and a specific embodiment is described below.
[0014] First, see Figure 2A As shown, a dry film 110 is provided, and the dry film 110 mainly includes a structure of at least three layers, which are at least one photoresist layer 111, a light-transmitting carrier film 112, and a protective film 113, wherein the photoresist layer 111 is a A photosensitive resin, which can be a positive photoresist or a negative photoresist, is formed on the light-transmissive carrier film 112 and covered by the protective film 113 . In this embodiment, the photoresist layer 111 is a negative photoresist used as an electroplating bump. Usually, the transparent carrier film 112 can be made of PET (polyester), or can be called Mylar film, and the protective film 113 can be made of PE (polyethylene).
[0015] Afterwards, see Figure 2B As shown, the dry film 110 is laminated to ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com