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Heat radiator

a heat radiator and heat treatment technology, applied in the direction of machine operation mode, lighting and heating apparatus, semiconductor/solid-state device details, etc., can solve the problems of low radiation effect of conventional heat radiators, inability to retain predetermined lows, and heat radiators still do not have satisfying radiating effects, etc., to achieve the effect of improving the radiating

Inactive Publication Date: 2005-07-21
HSIEH HSIN MAO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention aims to provide a heat radiator that can improve its radiating effect. The technical effects of this invention include better heat dissipation and more efficient transfer of heat to the surrounding area."

Problems solved by technology

However, the fan in operation also will generate heat and gradually become hot, so the radiating effect of the conventional heat radiator is low.
However, the temperature of the hot surface will rise, so the cold surface cannot retain the predetermined low temperature and the heat radiator still does not have a satisfying radiating effect.

Method used

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Examples

Experimental program
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Embodiment Construction

[0013] With reference to FIGS. 1-2, a heat radiator in accordance with the invention is composed of a water tank (10), a first radiating member (20), a second radiating member (30), a fan (40), and a cover (50).

[0014] The water tank (10) has a hollow body (not numbered) for containing a cooling liquid such as water (11), as shown in FIG. 3. Multiple barbs (12) are formed at upper edges of the water tank (10). A rim (not numbered) is formed in the water tank (10) and beneath the upper edges.

[0015] The first radiating member (20) is made of aluminum or other metals with a high heat conductivity. A top plate (21) is formed at a top of the first radiating member (20) and supported by the rim of the water tank (10) so as to position the first radiating member (20) in the water tank (10). The top plate (21) and the rim can be sealed together to prevent the water (11) from leaking out from the water tank (10). Multiple first fins (22) are formed beneath the top plate (21) and immersed in...

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PUM

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Abstract

A heat radiator includes a water tank containing cooling liquid. A first radiating member has a top plate secured at top edges of the water tank. Multiple first fins are formed beneath the top plate and immersed in the cooling liquid. A heat insulating pad is adhered on the top plate. At least one semiconductor refrigerating component is mounted on the top plate and has a hot surface abutting the top plate and a cold surface exposed from the heat insulating pad. A second radiating member is positioned on the first radiating member and has a bottom plate with an area over the semiconductor refrigerating component. Multiple second fins are formed on the bottom plate. A fan is mounted on the second fins of the second radiating member.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a heat radiator, and more particularly to a cooling means for lowering a temperature of a device or element which generates significant amounts of heat in operation. [0003] 2. Description of Related Art [0004] For lowering a temperature of a device or element such as a CPU, or electronic chips which generate lots of heat in operation, a heat radiator is generally mounted on the device or element. [0005] A conventional heat radiator includes multiple fins formed on a body, and a fan installed on the fins. However, the fan in operation also will generate heat and gradually become hot, so the radiating effect of the conventional heat radiator is low. [0006] A novel heat radiator assembled with a semiconductor refrigerating component utilizing the Peltire Effect is invented. The semiconductor refrigerating component includes a hot surface and a cold surface opposite to the hot surface wi...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F25B21/02H01L23/38H10N10/13
CPCF25B21/02F25B2321/0252H01L23/38H01L35/30H01L2924/0002H01L2924/00H10N10/13
Inventor HSIEH, HSIN-MAO
Owner HSIEH HSIN MAO