Apparatus and method for enhanced heat transfer

a technology of enhanced heat transfer and apparatus, applied in the field of thermal management technology, can solve the problem that the vibration device described below exceeds the performance of conventional immersion cooling devices, and achieve the effect of dissipating more energy

Inactive Publication Date: 2006-03-23
INNOVATIVE FLUIDICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0012] A cooling cell based on the submerged vibration-induced bubble ejection (VIBE) process in which small vapor bubbles attached to a solid surface are dislodged and propelled into the cooler bulk liquid capitalizes on the benefits of two-phase cooling while improving on traditional methods of implementing two-phase heat transfer. The

Problems solved by technology

The VIBE device described below exceeds the performance of conventional imme

Method used

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  • Apparatus and method for enhanced heat transfer
  • Apparatus and method for enhanced heat transfer
  • Apparatus and method for enhanced heat transfer

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embodiment 10

[0025] The chamber 11 could be constructed of any suitable material. Generally, the material used for the chamber 11 will depend to some degree on the particular fluid 12 in the chamber 11 and on the particular heat transfer characteristics desired. The preferred material from which the chamber 11 is to be constructed is a light-weight metallic material from which the chamber 11 can be easily and inexpensively manufactured. For example, the material for the chamber 11 of the present embodiment 10 is aluminum.

[0026] In the present embodiment 10, the entire chamber 11 is constructed from an aluminum material. However, in an alternative embodiment, the chamber 11 is manufactured from more than one material. In other words, different parts of the chamber 11 are manufactured from different materials. Such a configuration minimizes heat transfer to certain parts of the chamber 11, while maximizing heat transfer to other parts of the chamber 11.

[0027] More specifically, in this alternativ...

embodiment 50

[0056] An alternative embodiment of a VIBE apparatus 60 is depicted in FIG. 6. This embodiment 60 is very similar to the previous embodiment 50. However, small synthetic jet actuators 61, 62 have been placed within the chamber 11. Synthetic jet actuators, generally, are described in detail in U.S. Pat. No. 5,758,853 to Glezer et al., entitled “Synthetic Jet Actuators and Applications Thereof,” which is incorporated herein by reference. Basically, the synthetic jet actuators 61, 62 create jets 63, 64 of fluid without net mass injection into the chamber 11. The fluidic jets 63, 64 agitate the fluid 12 in the chamber 11 resulting in more effective heat transfer.

[0057] Other alternative embodiments of the VIBE device involve modifications of the actuator 22. One of these alternative embodiments involves using more than one actuator 22 in the chamber 1. An array of actuators is positioned along the upper wall 14 of the chamber 11. In another alternative embodiment, the actuator 22 compri...

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Abstract

One embodiment of the system is implemented as a device for two-phase heat transfer. This device comprises a chamber containing a fluid, where a heated wall makes up a portion of the chamber. The device also comprises an actuator that emits pressure vibrations. The pressure vibrations dislodge vapor bubbles that form at the heated wall due to the heat in the wall.

Description

CLAIM TO PRIORITY [0001] The present application claims the benefit of the filing date of U.S. Provisional Patent Application Ser. No. 60 / 603,436, filed on Aug. 20, 2004, which is hereby incorporated by reference herein.BACKGROUND [0002] 1. Technical Field [0003] The present invention is generally related to thermal management technology and, more particularly, is related to an apparatus and method for cooling heat-producing bodies or components using a two-phase cooling heat transfer device based on a vibration-induced bubble ejection process. [0004] 2. Description of the Related Art [0005] Cooling of heat-producing bodies is a concern in many different technologies. Particularly in microprocessors, the rise in heat dissipation levels accompanied by a shrinking thermal budget has resulted in the need for new cooling solutions beyond conventional thermal management techniques. In the microelectronics industry, for example, advances in technology have brought about an increase in tra...

Claims

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Application Information

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IPC IPC(8): F28D15/00
CPCF28D15/0266F28F13/10H01L23/427H01L23/473H01L2924/0002H05K7/20272H01L2924/00
Inventor GLEZER, ARIHEFFINGTON, SAMUEL NEILSMITH, MARC K.
Owner INNOVATIVE FLUIDICS
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