Apparatus and method for enhanced heat transfer

a technology of enhanced heat transfer and apparatus, applied in the field of thermal management technology, can solve the problem that the vibration device described below exceeds the performance of conventional immersion cooling devices, and achieve the effect of dissipating more energy
US20060060331A1Inactive Publication Date: 2006-03-23INNOVATIVE FLUIDICS +1
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
INNOVATIVE FLUIDICS
Publication Date
2006-03-23
Estimated Expiration
Not applicable · inactive patent

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Abstract

One embodiment of the system is implemented as a device for two-phase heat transfer. This device comprises a chamber containing a fluid, where a heated wall makes up a portion of the chamber. The device also comprises an actuator that emits pressure vibrations. The pressure vibrations dislodge vapor bubbles that form at the heated wall due to the heat in the wall.
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Description

CLAIM TO PRIORITY

[0001] The present application claims the benefit of the filing date of U.S. Provisional Patent Application Ser. No. 60 / 603,436, filed on Aug. 20, 2004, which is hereby incorporated by reference herein.BACKGROUND

[0002] 1. Technical Field

[0003] The present invention is generally related to thermal management technology and, more particularly, is related to an apparatus and method for cooling heat-producing bodies or components using a two-phase cooling heat transfer device based on a vibration-induced bubble ejection process.

[0004] 2. Description of the Related Art

[0005] Cooling of heat-producing bodies is a concern in many different technologies. Particularly in microprocessors, the rise in heat dissipation levels accompanied by a shrinking thermal budget has resulted in the need for new cooling solutions beyond conventional thermal management techniques. In the microelectronics industry, for example, advances in technology have brought about an increase in tra...

Claims

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