Method and apparatus for forming a through-hole and running wire in a building structure
a technology of building structure and throughhole, which is applied in the direction of roofs, building materials handling, construction, etc., can solve the problems of nicking power wires, water lines or gas lines disposed in the wall, and the insulation within the wall exacerbates this problem, so as to facilitate the routing of wires therethrough
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[0017] A method and apparatus for forming a through-hole in a building structure according to exemplary embodiments of the present invention are used to facilitate running wire through a partition wall. The apparatus forms a through-hole on either side of the partition wall while threading a wire through the formed through-hole. The apparatus includes an elongated member having a first end and an opposite second end. The first end includes a penetrating point configured to penetrate both sides of the partition wall upon manual manipulation of the same while the second end is configured to releasably retain a wire extending therefrom. In this manner, a through-hole is manually formed in the partition wall while wire is simultaneously run through the formed through-hole.
[0018] Thus, the above apparatus and method allow running wire through a building structure, such as an interior partition wall, without using a drill that may nick a structure within the wall with a sharp rotating dr...
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