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Non-Conformable Masks and Methods and Apparatus for Forming Three-Dimensional Structures

a three-dimensional structure, non-conformable technology, applied in the direction of microstructural technology, microstructural devices, coatings, etc., can solve the problem of destructive separation of masking materials from substrates

Inactive Publication Date: 2008-09-25
MICROFAB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The CC mask plating process is distinct from a “through-mask” plating process in that in a through-mask plating process the separation of the masking material from the substrate would occur destructively.

Method used

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  • Non-Conformable Masks and Methods and Apparatus for Forming Three-Dimensional Structures
  • Non-Conformable Masks and Methods and Apparatus for Forming Three-Dimensional Structures
  • Non-Conformable Masks and Methods and Apparatus for Forming Three-Dimensional Structures

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Embodiment Construction

[0068]FIGS. 1A-1C, 2A-2F, and 3A-3C illustrate various aspects of electrochemical fabrication that are known. Other electrochemical fabrication techniques are set forth in the '630 patent, in the various previously incorporated publications, in patent applications incorporated herein by reference, still other may be derived from combinations of various approaches described in these publications, patents, and applications, or are otherwise known or ascertainable by those of skill in the art. All of these techniques may be combined with those of the present invention to yield enhanced embodiments.

[0069]FIGS. 4A-4I illustrate various stages in the formation of a single layer of a multi-layer fabrication process where a second metal is deposited on a first metal as well as in openings in the first metal where its deposition forms part of the layer. In FIG. 4A, a side view of a substrate 82 is shown, onto which patternable photoresist 84 is cast as shown in FIG. 4B. In FIG. 4C, a pattern...

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Abstract

Electrochemical Fabrication techniques are used to modify substrates or to form multilayer structures (e.g. components or devices) from a plurality of overlaying and adhered layers. Masks are used to selectively etch or deposit material. Some masks may be of the contact type and may be formed of multiple materials some of which may be support materials, some of which may be mating materials for contacting a substrate and some may be intermediate materials. In some embodiments the contact masks may have conformable contact surfaces (i.e. surfaces with sufficient flexibility or deformability that they can substantially conform to surface of the substrate to form a seal with it) or they may have semi-rigid or even rigid surfaces. In embodiments where masks are used for selective deposition operations, etching operations may be performed after deposition to remove flash deposits (thin undesired deposits from areas that were intended to be masked).

Description

RELATED APPLICATIONS[0001]This application is a continuation of U.S. patent application Ser. No. 10 / 724,513, filed Nov. 26, 2003, which in turn claims benefit to U.S. Provisional Patent application No. 60 / 429,484, filed Nov. 26, 2002, which is incorporated herein by reference as if set fourth in full.FIELD OF THE INVENTION[0002]The present invention relates generally to the field of three-dimensional structure fabrication. In some embodiments, mesoscale or microscale structures are formed via electrochemical operations (e.g. electrochemical fabrication or EFAB™ processes, such as electrochemical deposition operations and / or etching operations). In some embodiments the structures are formed via deposition of a single layer of material while in other embodiments the structures are formed via a layer-by-layer build up of deposited materials. In particular, selective patterning of substrates occurs via a mask that is independent of the substrate.BACKGROUND OF THE INVENTION[0003]A techni...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C25D5/02B81C1/00
CPCB81C1/00182B33Y10/00
Inventor COHEN, ADAM L.SMALLEY, DENNIS R.
Owner MICROFAB