System For Recycling Printed Circuit Boards

a technology of printed circuit boards and recycling systems, applied in the manufacture of final products, electrolysis components, instruments, etc., can solve the problems of heavy metals that can seep into ground water and contaminate water supplies, and large amounts of obsolete electronic products

Inactive Publication Date: 2009-11-26
ECOSIGHT
View PDF9 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The fast pace of product life cycles in the electronics and computer industry results in large amounts of obsolete electronic products.
These electronic products represent a landfill problem.
These products often have heavy metals that can seep into ground water and contaminate water supplies.
In addition, the stringent rules of many landfills no longer allow these products to be thrown away.
One of the main problems in recycling electrical and electronics products is the circuit boards.
Unfortunately, this process is expensive, requires a tremendous amount of energy and introduces toxic off gasses into the atmosphere.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • System For Recycling Printed Circuit Boards
  • System For Recycling Printed Circuit Boards
  • System For Recycling Printed Circuit Boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012]A process for recycling printed circuit boards includes pyrolyzing a number printed circuit boards to from an ash. Metals form the circuit boards are separated from the ash by density separation techniques. The metals are formed into a slurry electrode. The slurry electrode and a deposition electrode are placed in an electrolyte bath and the metals are electrorefined to form bars of metal.

[0013]FIG. 1 is a block diagram of a process 10 of recycling printed circuit boards in accordance with one embodiment of the invention. The process 10 starts with printed circuit boards (PCBs) 12 undergoing pyrolysis 14. The pyrolysis machine 14 requires energy 16 and has outputs of crude oil 18, and flame retardants 20. The crude oil 18 can be reused as fuel oil or as feedstock. The flame retardant 20 can either be disposed of safely or reused. The carbon 22 can be added to fertilizer or safely land filled. The other output of the pyrolysis 14 is an ash containing metals and silica 24 and ca...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
ionicaaaaaaaaaa
voltageaaaaaaaaaa
currentaaaaaaaaaa
Login to view more

Abstract

A process for recycling printed circuit boards includes pyrolyzing a number printed circuit boards to from an ash. Metals form the circuit boards are separated from the ash by density separation techniques. The metals are formed into a slurry electrode. The slurry electrode and a deposition electrode are placed in an electrolyte bath and the metals are electrorefined to form bars of metal. The slurry electrode is made by combining powderized metals with carbon powder and an ionic liquid to form an electrode paste. The electrode paste is placed inside a container with a screen to form the slurry electrode.

Description

RELATED APPLICATIONS[0001]The present invention claims priority on provisional patent application, Ser. No. 61 / 128561, filed on May 22, 2008, entitled “Printed circuit board Recycling Process” and is hereby incorporated by reference.STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH[0002]This invention was made in the performance of a Cooperative Research and Development Agreement with the Department of the Air Force. The Government of the United States has certain rights to use the inventionTHE NAMES OF THE PARTIES TO A JOINT RESEARCH AGREEMENT[0003]Not ApplicableREFERENCE TO A SEQUENCE LISTING, A TABLE, OR A COMPUTER PROGRAM LISTING[0004]Not ApplicableBACKGROUND OF THE INVENTION[0005]The fast pace of product life cycles in the electronics and computer industry results in large amounts of obsolete electronic products. These electronic products represent a landfill problem. These products often have heavy metals that can seep into ground water and contaminate water supplies. Recent le...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(United States)
IPC IPC(8): C25C1/00C25C7/02
CPCC25C3/00C25C3/34H05K2203/178H05K2203/1136H05K3/22Y02P70/50
Inventor DILLS, JAMES CARLHALLING, DALE B.WILKES, JOHN S.TROTT, SANDRA
Owner ECOSIGHT
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products