Epoxy Resin Composition for Optical-Semiconductor Encapsulation, Cured Resin Thereof, and Optical Semiconductor Device Obtained with the same
a technology of semiconductor devices and encapsulation, which is applied in the direction of semiconductor/solid-state device details, solid-state devices, organic dyes, etc., can solve the problems of colorant disadvantageously changing the optical property of shielding near infrared rays, low shielding ability of glass, and insufficient use in illuminance sensors. , to achieve the effect of reducing or eliminating the property of shielding, preventing optical properties, and changing the optical properties of colorants
Inactive Publication Date: 2010-02-18
NITTO DENKO CORP
View PDF0 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
[0009] The present inventors have made a series of investigations in order to overcome the problem that an epoxy resin composition for optical-semiconductor encapsulation, which contains a conventional colorant which shields near infrared rays, changes in the optical properties of the colorant (in particular, decrease or elimination of the property of shielding near infrared rays) due to heating in molding, etc. As a result, they found that the optical properties can be prevented from deterioration during molding to get a cured resin and during a heat resistance test by using a naphthalocyanine colorant or a combination of a naphthalocyanine colorant and a phthalocyanine colorant. The invention has been thus achieved.
Problems solved by technology
However, there is the following problem.
However, the heat-ray-cutting laminated glass used in motor vehicles and other applications has a drawback that a compound which mainly absorbs or reflects middle infrared rays is contained in, e.g., the interlayer of the laminated glass and, hence, this glass is low in the ability to shield near infrared rays and is insufficient for use in the illuminance sensor application in which the invention is intended to be used.
That temperature is considerably lower than the curing temperature of resins for optical-semiconductor encapsulation, which should be about 120 to 170° C. Consequently, when a colorant used in PDPs or the like is used, this colorant undergoes alteration such as pyrolysis, due to the action of an acid or basic compound used in raw materials for the resin and due to heating in the step of curing the resin, whereby a problem, for example, that the colorant disadvantageously changes in the optical property of shielding near infrared rays occurs.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
examples 1 to 3
[0078] A phthalocyanine colorant and naphthalocyanine colorants were added in the amounts shown in Table 1 below to a mixture composed of 100 parts of an epoxy resin, 99 parts of a curing agent, and 1 part of a curing accelerator as shown in the table.
[0079] Each liquid resin composition obtained (epoxy resin composition for optical-semiconductor encapsulation) was poured into a mold having a thickness of 1 mm and heated at 150° C. for 3 hours to obtain a cured resin composition. This cured resin composition (1-mm thick) was examined with apparatus UV-3101PC (manufactured by Shimadzu Corp.) for a transmission spectrum. The results obtained are shown in FIG. 1 (Example 1), FIG. 2 (Example 2), and FIG. 3 (Example 3). As apparent from FIGS. 1 to 3, the cured resins obtained in Examples 1 to 3 had a transmittance in the near infrared region (750 to 900 nm) of 5% or lower.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more PUM
| Property | Measurement | Unit |
|---|---|---|
| wavelength range | aaaaa | aaaaa |
| wavelengths | aaaaa | aaaaa |
| wavelengths | aaaaa | aaaaa |
Login to view more
Abstract
The present invention relates to an epoxy resin composition for optical-semiconductor encapsulation which comprises the following ingredients (A) to (C): (A) an epoxy resin; (B) a curing agent; and (C) a naphthalocyanine colorant. The epoxy resin composition of the invention transmits visible rays and shields near infrared rays while retaining properties inherent in the epoxy resin.
Description
FIELD OF THE INVENTION [0001] The present invention relates to an epoxy resin composition for optical-semiconductor encapsulation which has excellent properties inherent in the epoxy resin, selectively transmits rays in the whole visible light region or specific visible rays, and simultaneously shields near infrared rays. The invention further relates to a cured resin obtained by curing the composition and an optical semiconductor device obtained through resin encapsulation with the epoxy resin composition for optical-semiconductor encapsulation. BACKGROUND OF THE INVENTION [0002] In cell phones, liquid-crystal TV's, and the like, the number of products having an illuminance sensor for regulating screen brightness has been increasing in recent years. Such an illuminance sensor is required to have the same sensitivity as the human eye. However, there is the following problem. The optical semiconductor element employed is sensitive not only to the visible rays but also to near infrare...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more Application Information
Patent Timeline
Login to view more Patent Type & Authority Applications(United States)
IPC IPC(8): C08K5/34
CPCC08K5/0091H01L23/293H01L2924/0002C08L63/00H01L2924/00C08K5/315
Inventor ITO, HISATAKAOTA, SHINYAFUKE, KAZUHIRO
Owner NITTO DENKO CORP
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Try Eureka
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap