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Heat dissipation device

a heat dissipation device and heat dissipation pipe technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device details, tubular elements, etc., can solve the problems of high risk of fin disengagement from heat pipes, noise, and weak connection integrity of fins,

Inactive Publication Date: 2010-12-09
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0006]What is needed is a heat dissipation device having a plurality of individual fins assembled together to obtain a fin unit with a rather firm structure.

Problems solved by technology

However, contacting areas between the fins and the heat pipes are so narrow that connective integrity thereof is too weak to securely assemble the fins together in use.
As a result, the fins are in high risk of suffering disengagement from the heat pipes, thereby being forced into a sympathetic vibration and producing noise in response to high-frequency vibration from the running fan.

Method used

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Examples

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Embodiment Construction

[0011]FIGS. 1-3 illustrate a heat dissipation device in accordance with an embodiment of the present disclosure. The heat dissipation device is provided for removing heat from a heat-generating component such as a CPU. The heat dissipation device comprises a base 10, a fin unit 20 located over the base 10, a plurality of heat pipes 30 thermally connecting the fin unit 20 and the base 10 together, a heat dissipating member 40 located between the fin unit 20 and the base 10, a fan 50 and two fan holders 60 securing the fan 50 to rear sides of the fin unit 20 and the heat dissipating member 40.

[0012]The base 10 comprises a rectangular conducting plate 12 and four fixing legs 14 extending diagonally from four corners of the conducting plate 12. The conducting plate 12 is made of material with a good heat conductivity such as copper and aluminum and defines a plurality of elongated receiving grooves 120 in a top surface thereof for receiving portions of the heat pipes 30. The receiving g...

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PUM

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Abstract

A heat dissipation device for removing heat from heat-generating components includes a fin unit. The fin unit includes a plurality of fins stacked together. Each fin is wave-shaped in profile and comprises a plurality of wave crests and wave troughs alternately arranged with each other. The wave crests of one of the fins respectively engage the wave troughs of a neighboring upper one of the fins. The wave troughs of the one of the fins are separated from and located below the corresponding wave crests of the upper one of the fins.

Description

BACKGROUND[0001]1. Technical Field[0002]The present disclosure relates generally to a heat dissipation device and, more particularly, to a heat dissipation device comprising a plurality of individual fins assembled together for removing heat from a heat-generating electronic component to ambient environment.[0003]2. Description of Related Art[0004]Heat dissipation devices are usually used to remove heat from heat-generating electronic components, such as central processing units (CPUs), light emitting diodes (LEDS) and power transistors, etc., to keep the components in stable operation.[0005]Conventionally, the heat dissipation device comprises a solid base, a plurality of fins horizontally arranged on the base, a plurality of heat pipes connecting the fins and the base together and a fan mounted to one side of the fins. The base contacts the heat-generating electronic components to absorb heat generated by the heat-generating electronic components. The heat pipes comprise evaporati...

Claims

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Application Information

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IPC IPC(8): F28F7/00
CPCH01L23/3672H01L23/4006H01L23/427H01L23/467H01L2924/0002H01L2924/00
Inventor LIAN, ZHI-SHENGDENG, GEN-PINGCHEN, CHUN-CHI
Owner FU ZHUN PRECISION IND SHENZHEN