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Heat dissipation structure having combined cooling fins

Inactive Publication Date: 2011-08-18
SUN LITE SOCKETAB IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0009]An object of the present invention is to provide a heat dissipation structure having combined cooling fins, which comprises a metal base and a plurality of cooling fins, wherein the metal base is formed with a receiving space therein for receiving a heat generating object (such as a light emitting lamp, a computer CPU, a transformer, etc.), and an outer surface of the metal base is equidistantly formed with a plurality of recesses. Furthermore, each of the cooling fins is formed by punching and bending a one-piece metal plate to be a U-shaped structure, while each of the cooling fins includes two heat dissipation portions and an elastic engagement portion, wherein each of the two heat dissipation portions is a planar plate, and the elastic engagement portion is a U-shaped plate. Two ends of the elastic engagement portion have resilience, and the two ends thereof are connected to one end of each of the two heat dissipation portions, respectively. In addition, the two ends of the elastic engagement portion can be pressed to be close to each other, so that the elastic engagement portion will be deformed for being inserted and received in each of the recesses. Meanwhile, an outer surface of the elastic engagement portion can be engaged with an inner surface of each of the recesses of the metal base by the resilience of the elastic engagement portion, so that heat generated by the heat generating object can be transferred from the metal base to the cooling fins. Therefore, the heat generated by the heat generating object can be rapidly transferred from the metal base to the cooling fins, and then dissipated to the ambient atmosphere through the cooling fins. In the traditional heat dissipation structure, one end of each of the cooling fins must be firstly inserted into each of the recesses of the annular lamp holder and then each of the grooves formed between two of the adjacent recesses is pressed by a press tool, so that two sides of the end of each of the cooling fins are pushed by two of the adjacent pressed grooves close thereto, and then the end of each of the cooling fins is engaged in each of the recesses for tightly com

Problems solved by technology

However, because the luminous efficiency of an LED lamp is in direct proportion to heat generated by the LED lamp, meaning that an LED lamp having higher brightness will generate more waste heat, so as to cause the damage of the LED lamp.
In addition, after a lamp holder of the LED lamp is long-term used under considerable waste heat, there will be some serious problems including material aging and light attenuation resulting in shortening the usage life of the lamp holder.
However, because the traditional heat dissipation structure 10 is integrally formed by extruding a metal material through a metal extruder, the thickness of the cooling fins 12 formed by an extrusion process is generally too thick due to the limitation of current technology of the extrusion process.
As a result, the amount of the cooling fins 12 on the base

Method used

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  • Heat dissipation structure having combined cooling fins
  • Heat dissipation structure having combined cooling fins
  • Heat dissipation structure having combined cooling fins

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Embodiment Construction

[0015]The present invention is related to a heat dissipation structure having combined cooling fins. Referring now to FIG. 3, a heat dissipation structure having combined cooling fins according to a first preferred embodiment of the present invention is illustrated. As shown, the heat dissipation structure designated by numeral 40 comprises a metal base 41 and a plurality of cooling fins 42, wherein a first surface of the metal base 41 (such as a lower surface) can be attached to one surface of a heat generating object (not shown, such as a light emitting lamp, a computer CPU, a transformer, etc.), and a second surface thereof (such as an upper surface) is equidistantly formed with a plurality of recesses 44. Each of the cooling fins 42 is formed by punching and bending a one-piece metal plate to form a U-shaped structure. Meanwhile, each of the cooling fins 42 includes two heat dissipation portions 45 and an elastic engagement portion 46, wherein each of the two heat dissipation po...

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Abstract

The present invention relates to a heat dissipation structure comprising a metal base and a plurality of cooling fins, wherein the metal base is formed with a receiving space therein for receiving a heat generating object, an outer surface of the metal base is equidistantly formed with a plurality of recesses, each of the cooling fins is formed by a U-shaped metal plate including two heat dissipation portions and an elastic engagement portion, the elastic engagement portion is in U-shape and has two ends connected to one end of each of the two heat dissipation portions respectively, and an outer surface of the elastic engagement portion can be engaged with an inner surface of each of the recesses by the resilience thereof, so as to efficiently increase the amount and heat dissipation area of the cooling fins and greatly enhance the heat dissipation efficiency of the heat dissipation structure.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a heat dissipation structure, and more particularly to a heat dissipation structure comprising a metal base and a plurality of cooling fins, wherein the metal base is formed with a receiving space therein for receiving a heat generating object, an outer surface of the metal base is equidistantly formed with a plurality of recesses, each of the cooling fins includes two heat dissipation portions and an elastic engagement portion, and an outer surface of the elastic engagement portion can be engaged with an inner surface of each of the recesses by the resilience thereof. Therefore, the present invention not only can efficiently increase the amount of the cooling fins and the direct contact area between the heat dissipation structure and the ambient atmosphere so as to enhance the heat dissipation efficiency of the heat dissipation structure, but also can efficiently simplify the installation process of the cooling fins witho...

Claims

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Application Information

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IPC IPC(8): F28F7/00
CPCF21V29/246H01L23/3672F21Y2101/02H01L2924/0002F21V29/773F21V29/89F21Y2115/10F21V29/76H01L2924/00
Inventor CHEN, TSAN-CHI
Owner SUN LITE SOCKETAB IND