Vapor chamber structure

Abstract

An improvement to a vapor chamber structure comprises a first body, a second body, and a working fluid. The first body has a plurality of first channels and a plurality of second channels, the first and second channels communicating with one another. The second body has a third channel, the first and second bodies and the first, second, and third channels communicate with one another and has a wick structure and are filled with a working fluid. By means of such a design of the present invention, the first body has the effect of uniform heat dissipation and the remote heat dissipation can be achieved through the second body. Consequently, the whole heat dissipation can be considerably improved.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to an improvement to a vapor chamber structure and in particular to an improvement to a vapor chamber structure with a large area for uniform heat transfer and remote heat dissipation.[0003]2. Description of Prior Art[0004]With the compact size of the present electronic apparatus gradually becoming the appealing demand, each component of the electronic apparatus thus continues to shrink. However, the size shrinking of the electronic apparatus is accompanied with the heat dissipation issue which becomes the major barrier against an improvement to the performance of the electronic apparatus and system. Even the semiconductor sizes of the electronic components continue to shrink; there is still a constant demand for outstanding performance[0005]When the semiconductor size shrinks, the induced heat flux increases consequently. The challenge caused by an increase in heat flux to cool the heated ...

AI Technical Summary

Benefits of technology

The present invention aims to improve the heat dissipation of a vapor chamber structure. It achieves this by providing an effective means for heat transfer and remote heat dissipation, which significantly improves the overall heat dissipation of the vapor chamber.

Problems solved by technology

However, the size shrinking of the electronic apparatus is accompanied with the heat dissipation issue which becomes the major barrier against an improvement to the performance of the electronic apparatus and system.

The challenge caused by an increase in heat flux to cool the heated product is more severe than the total amount of the increased heat.

Due to the increase in heat flux, the overheating issue about the electronic products will occur for various sizes at any time, causing damage to and failure in the electronic components.

It has the advantages of a larger area for heat transfer and a fast heat transfer rate; however, its disadvantage is that it can not transfer and dissipate the heat to a remote end.

This is the main disadvantage of the VC.

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