Electrochemical Fabrication Process for Forming Multilayer Multimaterial Microprobe Structures

Abstract

Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.

Description

RELATED APPLICATIONS[0001]This application is a continuation of U.S. patent application Ser. No. 11 / 029,211 (Microfabrica docket number P-US138-A-MF), filed Jan. 3, 2005 which claims benefit to U.S. Provisional Patent Application Nos. 60 / 533,897, 60 / 533,975, 60 / 533,947, 60 / 533,948, each filed on Dec. 31, 2003; and to 60 / 540,510, filed Jan. 29, 2004; this application is also a CIP of U.S. patent application Ser. No. 10 / 949,738 (Microfabrica docket P-US119-A-MF), filed Sep. 24, 2004 which in turn is a CIP of Ser. No. 10 / 772,943 (Microfabrica docket P-US097-A-MF), which in turn claims benefit of U.S. App. Nos. 60 / 445,186; 60 / 506,015; 60 / 533,933, and 60 / 536,865; furthermore the '738 application claims benefit of U.S. App. Nos. 60 / 506,015; 60 / 533,933; and 60 / 536,865. Each of these applications, including any appendices attached thereto, is incorporated herein by reference as if set forth in full herein.FIELD OF THE INVENTION[0002]The present invention relates generally to the field of El...

AI Technical Summary

Benefits of technology

This approach enables the creation of structures with improved mechanical and electrical properties by ensuring uniform coating and encapsulation of structural materials, overcoming previous limitations in multi-material processing and structure formation.

Problems solved by technology

The CC mask plating process is distinct from a “through-mask” plating process in that in a through-mask plating process the separation of the masking material from the substrate would occur destructively.

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