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Method for electroless plating

a metal plating and electroless technology, applied in the direction of coatings, printed circuit manufacturing, liquid/solution decomposition chemical coatings, etc., can solve the problems of reducing the adhesion between the substrate and the metal film, and obtaining a plating film with high adhesion is difficult, so as to achieve less foaming and high adhesion

Inactive Publication Date: 2018-06-28
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0007]The present inventor conducted intensive studies and found that the addition of a triamine compound having a specific alkylene chain length to the conditioner instead of catio

Problems solved by technology

However, with a method that provides adhesion primarily by an anchoring effect, if the degree of roughness of the resin substrate surface is re

Method used

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  • Method for electroless plating
  • Method for electroless plating
  • Method for electroless plating

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Abstract

To provide a conditioner having less foaming property and having adhesion higher than the conventional conditioner using a cationic polymer or the like and, and an electroless plating method using the same. A method of the present invention for performing an electroless plating including the steps of:
    • (a) putting the substrate in contact with a composition containing a compound represented by the following general formula (1)
H2N—R1—NH—R2—NH2  (1)
    • wherein, R1 and R2 are each independently an alkylene group having 3 to 10 carbon atoms;
    • (b) putting the substrate in contact with a catalyst composition; and (c) putting the substrate in contact with an electroless plating composition.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a method for electroless metal plating on a resin substrate, particularly a printed wiring board, and more particularly relates to a method of forming a metal film having high adhesion on the surface of a resin substrate with a pretreatment solution containing a specific compound.BACKGROUND OF THE INVENTION[0002]Electrical connection between layers of a printed wiring board is generally performed via very small holes known as through holes. As a method of forming a conductive film on the surface of the printed wiring board and in the inner wall surface of these through holes, a method of treating with a pretreatment solution (also referred to as a conditioner) containing a cationic polymer and a surfactant, applying a catalyst containing palladium and the like, and then forming a metal film by an electroless plating method is generally used.[0003]In order to improve the adhesion between a resin substrate and a conductive f...

Claims

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Application Information

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IPC IPC(8): C23C18/38C23C18/18
CPCC23C18/38C23C18/18C23C18/20C23C18/26C23C18/1653C23C18/2086C23C18/1641H05K3/181
Inventor HAKIRI, YOSHIYUKI
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC