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Thermal chamber with improved thermal uniformity

a technology of thermal uniformity and thermal chamber, which is applied in the direction of coating, chemical vapor deposition coating, metallic material coating process, etc., can solve the problem of temperature non-uniformity of the heated substra

Pending Publication Date: 2018-11-22
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent describes different embodiments of semiconductor processing chambers that have a chamber body with a substrate transfer port and one or more absorber bodies positioned inside the chamber. These absorber bodies can absorb light or other particles that may affect the semiconductor processing. The technical effect of this design is to provide a more stable and reliable environment for semiconductor processing.

Problems solved by technology

This results in temperature non-uniformity of the substrate being heated.

Method used

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  • Thermal chamber with improved thermal uniformity
  • Thermal chamber with improved thermal uniformity
  • Thermal chamber with improved thermal uniformity

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Embodiment Construction

[0023]Embodiments of the disclosure generally relate to a semiconductor processing chamber and, more specifically, a thermal processing chamber. Embodiments disclosed herein are illustratively described below in reference to anneal chambers. Examples of substrate processing systems that may be adapted to benefit from the embodiments described herein include a PRODUCER® SE CVD system, a PRODUCER® GT™ CVD system or a DXZ® CVD system, all of which are commercially available from Applied Materials, Inc., Santa Clara, Calif. The Producer® SE CVD system (e.g., 200 mm or 300 mm) has two isolated processing regions that may be used to anneal substrates. Although the exemplary embodiment includes two processing regions, it is contemplated that the embodiments described herein may be used to advantage in systems having a single processing region or more than two processing regions. It is also contemplated that the embodiments described herein may be utilized to advantage in other thermal proc...

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Abstract

Embodiments of the disclosure generally relate to a semiconductor processing chamber. In one embodiment, semiconductor processing chamber is disclosed and includes a chamber body having a bottom and a sidewall defining an interior volume, the sidewall having a substrate transfer port formed therein, and one or more absorber bodies positioned in the interior volume in a position opposite of the substrate transfer port.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims benefit of U.S. Provisional Patent Application Ser. No. 62 / 507,934, filed May 18, 2017, which application is hereby incorporated by reference herein.BACKGROUNDField[0002]Embodiments disclosed herein generally relate to a semiconductor processing chamber and, more specifically, a thermal treatment chamber, such as an annealing chamber.Description of the Related Art[0003]In the manufacture of electronic devices on a substrate, substrates, such as a semiconductor substrate, are subjected to many thermal processes. The thermal processes are typically performed in a dedicated processing chamber where material is deposited or removed, or a substrate is heated in a controlled manner. Such processes include epitaxial deposition, chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), etching, annealing, and the like.[0004]A substrate is typically supported in the processing chamber and exposed to...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L21/67C23C16/56C23C16/458C23C16/455
CPCH01L21/67103C23C16/56C23C16/4583C23C16/45565H01L21/68742C23C16/46H01L21/6719H01L21/68735H01L21/6875H01L21/68792H01L21/67098H01L21/67017C23C16/44H01L21/683
Inventor IU, DONGMINGSHAH, KARTIKTAM, NORMAN L.SPULLER, MATTHEWCHEN, JAU-JIUNCHAN, KONG LUNG SAMUELNEVILLE, ELIZABETHRAO, PREETHAMMAYUR, ABHILASH J.PHAM, GIA
Owner APPLIED MATERIALS INC