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Conductive multilayer sheet for thermal forming and injection molding applications

a technology of thermal forming and injection molding, which is applied in the direction of other domestic articles, synthetic resin layered products, coatings, etc., can solve the problems of difficult thermoforming of articles from the substrates with the conductive layers, and damage to the substrate materials

Inactive Publication Date: 2019-05-23
SABIC GLOBAL TECH BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, some substrate materials can be damaged by a sintering process.
Additionally, it can be difficult to thermoform a

Method used

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  • Conductive multilayer sheet for thermal forming and injection molding applications
  • Conductive multilayer sheet for thermal forming and injection molding applications
  • Conductive multilayer sheet for thermal forming and injection molding applications

Examples

Experimental program
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examples

[0067]In the following examples, haze was tested according to ASTM D1003 procedure A using CIE standard illuminant C using a Haze-Gard test device, while adhesion between the ultraviolet curable coating layer and the substrate was measured according to ASTM D3359, where a value of 5B mean 100% adhesion on the substrate and 0B means 100 delamination between the ultraviolet curable coating layer and the substrate. The relationship between conductive film elongation percentage and surface resistivity was characterized by a Dynamic Mechanical Analysis (DMA) method.

[0068]The conductive film used is commercially available from CIMA (SANTE™) which uses self-aligning nano-technology to obtain a silver network on a substrate. There are two types of SANTE™ film, one is a SANTE™ film with a transfer resin, which is for easy transfer from a base, e.g., PET, to another substrate, while the other SANTE™ film is without a transfer resin. Properties for these two types of film are illustrated in Ta...

embodiment 1

[0083]An article of manufacture, comprising: a mold insert comprising a substrate including a substrate first surface and a substrate second surface; an ultraviolet curable coating layer including a coating first surface and a coating second surface, wherein the ultraviolet curable coating layer comprises a multifunctional acrylate oligomer; and an acrylate monomer; wherein the ultraviolet curable coating layer includes a total weight, wherein 30% to 80% of the total weight comprises the multifunctional acrylate oligomer, and wherein 15% to 65% of the total weight comprises the acrylate monomer, wherein the coating first surface of the ultraviolet curable coating layer is adjacent to the substrate first surface; and a conductive layer adjacent to the coating second surface, wherein the conductive layer includes nanometer sized metal particles arranged in a network; and a polymeric resin layer coupled to a portion of the substrate second surface.

embodiment 2

[0084]The article of manufacture of Embodiment 1, wherein the acrylate monomer comprises 1,6-hexanediol diacrylate, tripropylene glycol diacrylate (TPGDA), or a combination comprising at least one of the foregoing.

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Abstract

A method of forming an article of manufacture, comprising: forming a mold insert, comprising applying a conductive layer on a donor substrate second surface, wherein the conductive layer includes nanometer sized metal particles arranged in a network; applying an ultraviolet curable coating layer to a recipient substrate first surface; pressing the recipient substrate, the ultraviolet curable coating layer, and the donor substrate together to form a stack; heating the stack and activating the ultraviolet cured coating layer with an ultraviolet radiation source; removing the donor substrate from the stack, wherein the ultraviolet curable coating layer adheres to the recipient substrate first surface and the conductive layer; thermoforming the mold insert; and injection molding a polymeric resin layer around a portion of the recipient substrate second surface.

Description

BACKGROUND[0001]Conductive layers can be useful in a variety of electronic devices. These layers can provide a number of functions such as electromagnetic interference shielding and electrostatic dissipation. These layers can be used in many applications including, but not limited to, touch screen displays, wireless electronic boards, photovoltaic devices, conductive textiles and fibers, organic light emitting diodes, electroluminescent devices, and electrophoretic displays, such as e-paper.[0002]Conductive layers can include a network-like pattern of conductive traces formed of metal. The conductive layer can be applied to a substrate as a wet coating which can be sintered to form these networks. However, some substrate materials can be damaged by a sintering process. Additionally, it can be difficult to thermoform articles from the substrates with the conductive layers and conductivity can suffer from substrates which are thermoformed.[0003]Thus, there is a need in the art for a c...

Claims

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Application Information

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IPC IPC(8): B32B27/08B32B27/36B29C45/14B29B11/06
CPCB32B27/08B32B27/365B29C45/1418B29B11/06B29C45/14336B32B2255/10B32B2255/205B32B2255/26B32B2255/28B32B2264/105B32B2307/202B32B2307/412B32B2457/208B32B2457/12B32B27/281B32B27/285B32B27/302B32B27/304B32B27/308B32B27/32B32B27/325B32B27/36B32B2255/24B32B2307/206B32B2457/00B32B17/10B29C51/14B32B2038/0076B32B2250/24B32B2310/0831
Inventor XU, YUZHENFENG, WEICHEN, ZHEXU, YONGLEICHEN, TSAN-MING
Owner SABIC GLOBAL TECH BV