Flip-chip light-emitting module

Inactive Publication Date: 2019-12-12
ANHUI HAIHUA CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present patent provides a flip-chip light-emitting module that has better heat-dissipating ability and smaller size. By connecting the light-emitting chip and thermal dissipation substrate, heat transfer is improved. The module can be connected to an external component, such as a main circuit board, in flip-chip form, eliminating the need for wire bonding and reducing size. This allows for faster switching of electronic products with light-emitting chips without signal delay.

Problems solved by technology

The main circuit board 91 is made of polymers, and thus it has poor heat conductivity and heat-dissipating ability.
If there is no structural design for heat dissipation, the light-emitting chip 92 attached thereto is easily overheated and damaged due to the poor heat-dissipating ability.
Therefore, this packaging design has an inadequacy of difficulty for further decreasing the size of the light-emitting module 9.

Method used

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Examples

Experimental program
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first embodiment

[0032]Referring to FIG. 2, a first embodiment of the present disclosure provides a flip-chip light-emitting module adapted for mounting on a main circuit board 7 in order to cooperate with the main circuit board 7, or adapted for electrically connecting to an external power source and being driven. The method and field of use are not the focus of the present invention, thus they are not described in detail herein.

[0033]The flip-chip light-emitting module includes a thermal dissipation substrate 1, a light-emitting chip 2, a conductive adhesive layer 3, a package assembly 4, and a conductor 6.

[0034]The thermal dissipation substrate 1 is selected from the group consisting of an albumin substrate, a copper substrate, and any substrates having good heat-dissipating or heat-conductive abilities. One side of the thermal dissipation substrate 1 is adapted for electrically connecting to the main circuit board 7, and another side of the thermal dissipation substrate 1 is connected to light-e...

second embodiment

[0052]Referring to FIG. 7, a second embodiment of the present disclosure is roughly the same as the first embodiment, and the main difference between the present embodiment and the first embodiment is that the light-emitting chip 2 includes two top conductive contacts 21 and two bottom conductive contacts 22, and correspondingly the thermal dissipation substrate 1 includes two separated plates 11. The adjacent plates 11 together define a thermal dissipation channel 12.

[0053]The thermal dissipation substrate 1 may include two, three, or more than four plates 11. The number of the plates 11 can be adjusted according to particular implementations. In this embodiment, the number of the plates 11 is two, and the number of the thermal dissipation channel 12 is one.

[0054]Therefore, the second embodiment has the same advantages of the first embodiment, and further discloses another feasible structure of the light-emitting chip 2 that includes multiple bottom conductive contacts 22. Correspo...

third embodiment

[0056]Referring to FIG. 8, a third embodiment of the present disclosure is roughly the same as the first embodiment, and the main difference between the present embodiment and the first embodiment is that the lens unit 44 does not include the support 441 (shown in FIG. 2), and the lens 431 is directly disposed on the frame 41, that is, the frame 41 also has the function of the support 441.

[0057]Removing the support 441 (shown in FIG. 2) can further decrease the height of the flip-chip light-emitting module and reduce the overall size. Therefore, the third embodiment has the advantages of the first embodiment, and can further decrease the size of the flip-chip light-emitting module.

[0058]Furthermore, the configurations of the conductive contacts 21, 22 of the light-emitting chip 2 are the same as shown in the first embodiment, thus users can adjust them according to their actual needs without any limitation. However, for ease of explanation, the light-emitting chip 2 of the present e...

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PUM

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Abstract

A flip-chip light-emitting module includes a thermal dissipation substrate, a package assembly, and a light-emitting chip. The package assembly includes a frame surrounding the thermal dissipation substrate, and a lens unit disposed on the frame. The frame includes a conductive path. The light-emitting chip is disposed on the thermal dissipation substrate, and includes a top conductive contact and a light-emitting surface at the same side. The top conductive contact is electrically connected with the conductive path by a conductor.

Description

CROSS-REFERENCE TO RELATED PATENT APPLICATION[0001]This application claims the benefit of priority to Taiwan Patent Application No. 107119481, filed on Jun. 6, 2018. The entire content of the above identified application is incorporated herein by reference.[0002]Some references, which may include patents, patent applications and various publications, may be cited and discussed in the description of this disclosure. The citation and / or discussion of such references is provided merely to clarify the description of the present disclosure and is not an admission that any such reference is “prior art” to the disclosure described herein. All references cited and discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference.FIELD OF THE DISCLOSURE[0003]The present disclosure relates to a light-emitting module, and more particularly to a flip-chip light-emitting module.BACKGROUN...

Claims

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Application Information

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IPC IPC(8): H01L33/62H01L33/64
CPCH01L33/62H01L33/38H01L33/641H01L33/48H01L33/64H01L33/486H01L33/58H01L25/0753F21S2/005F21V29/70F21V29/89F21Y2115/00
Inventor LIN, KUNG-ANYANG, CHUNG-CHELIN, HUNG-WEICHENG, HSIANG-YUN
Owner ANHUI HAIHUA CHEM
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