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Interconnect for high-frequency printed circuit

a printed circuit and high-frequency technology, applied in the direction of printed element electric connection formation, high-frequency circuit adaptation, waveguide, etc., can solve the problems of less or greater insertion loss on the signal, far from optimal interconnection, etc., to improve the transparency of via-type interconnection, reduce transmission losses, and increase matching levels

Inactive Publication Date: 2015-02-17
THALES SA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention improves the clarity of an interconnect in a printed circuit that links two transmission lines on different sides of the circuit. The aim is to improve the chances of successful transmission and reduce the loss of signal.

Problems solved by technology

These effects, notably linked to the intrinsic inductive nature of the via 15, then result in a mismatching and greater or lesser insertion losses on the signal.
Given these results, the interconnect is far from optimal.

Method used

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  • Interconnect for high-frequency printed circuit
  • Interconnect for high-frequency printed circuit
  • Interconnect for high-frequency printed circuit

Examples

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Embodiment Construction

[0021]FIG. 6 represents an enlarged view of the printed circuit 10 around the interconnect which, this time, comprises two vias 20 and 21 linking the two transmission lines 13 and 14, each of which extends in a main direction, respectively 22 and 23. The main directions each belong to the plane in which the external faces 11 and 12 of the printed circuit extend. The two vias 20 and are tubular-section metallized holes each extending along an axis, respectively 24 and 25. The vias are, for example, produced by drilling the printed circuit followed by metallization. The vias 20 and 21 then have a circular section perpendicularly to their respective axes 24 and 25. Other machining methods may replace the drilling, such as, for example, laser cutting. A straight line 28 perpendicular to the main direction 22 passes through the two intersections 26 and 27 of the axes 24 and 25 with the plane of the face 11. In this embodiment, the main directions 22 and 23 are parallel.

[0022]This interco...

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PUM

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Abstract

The invention relates to a printed circuit for high-frequency signals, and more particularly to interconnect means between transmission lines situated on different faces of the printed circuit. According to the invention, in the vicinity of the interconnect means, the transmission lines each extend in a main direction. The interconnect means comprise two vias each extending along an axis. In a plane containing the main direction of a first of the transmission lines and perpendicular to the face bearing the first transmission line, an orthogonal fix is formed whose abscissa is borne by the main direction of the first transmission line. The abscissae of the axes of the vias or of their projection on the plane, perpendicularly to the plane, are separate.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims priority to foreign French patent application No. FR 09 04348, filed on Sep. 11, 2009, the disclosure of which is incorporated by reference in its entirety.FIELD OF THE INVENTION[0002]The invention relates to a printed circuit for high-frequency signals, and more particularly to interconnect means between transmission lines situated on different faces of the printed circuit. The invention is of particular use for the transmission of radio frequency signals in the X band, in particular for frequencies of 9 to 10 GHz. The invention can be adapted to other frequency bands.BACKGROUND[0003]In order to convey high-frequency signals, a so-called microstrip technology implemented on a printed circuit is, for example, used. Printed conductive tracks are produced on faces of the printed circuit. These faces may be external or internal and may be separated by one or more conductive planes. The microstrip lines have particular ...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H05K1/11H01P3/08H05K1/02H05K3/42
CPCH05K1/115H01P3/081H05K1/0251H05K1/116H05K3/429H05K2201/09627H05K2201/09718H05K2201/0979
Inventor CORNIC, PASCALCOUPEZ, JEAN-PHILIPPEHEMERY, JEREMIEBOUCHER, JULIEN
Owner THALES SA