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Substrate transfer device, substrate transfer method, and storage medium

a substrate transfer and substrate technology, applied in the direction of thin material processing, article separation, electrical equipment, etc., can solve the problem of difficulty in reducing the time required for checking, and achieve the effect of suppressing the height of the substrate transfer devi

Active Publication Date: 2015-12-15
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent describes a method for reducing the height of a substrate transfer device that has a reciprocating unit and a rotating unit. The device is designed to open and close a door and can move back and forth and rotate to transfer substrates. The technical effect of this invention is that it provides a means for reducing the required height of the substrate transfer device, as there is no need to move the door up and down.

Problems solved by technology

Therefore, it is difficult to reduce a time required for checking an arrangement status of the wafer.

Method used

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  • Substrate transfer device, substrate transfer method, and storage medium
  • Substrate transfer device, substrate transfer method, and storage medium
  • Substrate transfer device, substrate transfer method, and storage medium

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Embodiment Construction

[0055]There will be explained a coating and developing apparatus 1 including a substrate transfer device of an illustrative embodiment. FIGS. 1, 2, and 3 are a front view, a schematic perspective view, and a schematic side view of the coating and developing apparatus 1, respectively. The coating and developing apparatus 1 includes a carrier block A1, a processing block A2, and an interface block A3, which are linearly connected to each other. The interface block A3 is connected to an exposure device A4 opposite to the processing block A2. An outside of the coating and developing apparatus 1 serves as a transfer region 11 of a carrier C, and the carrier C is a substrate transfer vessel configured to accommodate therein a wafer W.

[0056]A function of each block will be explained briefly. The carrier block A1 serves as a substrate transfer device of an illustrative embodiment and transfers the carrier C that accommodates the wafer W to and from a ceiling transfer unit 12 depicted in FIG...

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Abstract

A substrate transfer device that transfers a substrate by allowing a substrate opening formed on a front surface of a substrate transfer vessel to face an opening formed on a partition wall from one side of the partition wall and separating a cover body of the substrate transfer vessel from the other side of the partition wall includes a door configured to open and close the opening from the other side of the partition wall; a reciprocating unit configured to straightly move the door back and forth between a first position where the opening is closed and a second position away from the first position toward the other side of the partition wall; and a rotating unit configured to rotate the door around a rotation axis in a straightly moving direction of the door between the second position and a third position deviated from a region facing the opening.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of Japanese Patent Application No. 2012-091111 filed on Apr. 12, 2012, the entire disclosures of which are incorporated herein by reference.FIELD OF THE INVENTION[0002]The present disclosure relates to a substrate transfer device that transfers a substrate between a substrate transfer region at a side of a partition wall and a transfer vessel to be transferred to the other side of the partition wall, a substrate transfer method, and a storage medium that stores a program for performing the substrate transfer method.BACKGROUND OF THE INVENTION[0003]By way of example, in a semiconductor device manufacturing process, there has been used a coating and developing apparatus that performs a resist coating process or a developing process on a semiconductor wafer (hereinafter, referred to as “wafer”). This coating and developing apparatus includes a carrier block to which a carrier is transferred from an outside,...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01L21/677H01L21/67
CPCH01L21/677H01L21/67265H01L21/67772H01L21/67775H01L21/67778
Inventor IIDA, NARUAKITERAMOTO, AKIHIRO
Owner TOKYO ELECTRON LTD