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Device for galvanizing member-shaped substrates

A technology for electroplating devices and disks, which can be used in sealing devices, circuits, electrolytic components, etc., and can solve problems such as complicated installation and O-ring damage

Inactive Publication Date: 2007-09-26
专用机械制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, the insertion of the O-ring 18 is very complicated, since the O-ring 18 has to be strongly stretched to fit into such an annular groove, and it is also possible that the O-ring is damaged by this operation

Method used

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  • Device for galvanizing member-shaped substrates
  • Device for galvanizing member-shaped substrates
  • Device for galvanizing member-shaped substrates

Examples

Experimental program
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Embodiment Construction

[0026] FIG. 1 is a comparative example showing the prior art of a wafer electroplating apparatus B. As shown in FIG. An O-ring 18 is provided therein, which serves to seal the electrolyte area and at the same time center the wafer disc, and also seal the gap 21 of the assembly system.

[0027] Due to the up-and-down reciprocation during assembly of the parts of the device, in particular the sealing ring 3, there is a risk of friction grooves being formed on the O-ring 18 and the associated risk of leakage of the electrolyte solution. Furthermore, the laterally active gap at gap 21 is too large, so that the edge region of the wafer disk cannot be plated with precision and stability. Thus the centering of the wafer disk will not be very good. Fitting the O-ring 18 in the groove of the intermediate part 16 is complicated because in order to fit the O-ring 18 in the groove, the O-ring must be stretched strongly. There is therefore a risk of deformation of the O-ring, and also a ...

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Abstract

The invention relates to a plating device used for the plating wafer round disc. The invention comprises a device which is provided with an upper airproofing ring (3), two O-shaped ring embedding grooves which are respectively arranged on the two ends of the airproofing ring (3), an O-shaped ring (6) which is embedded into the upper groove of the airproofing ring (3) and an O-shaped ring (7) which is embedded into the lower groove of the airproofing ring (3), and the device is provided with an additionally lower airproofing ring or a round airproofing disc (10) which has a relative groove used for embedding the lower O-shaped ring (7) and the airproofing ring (3) as well as the round airproofing disc (10) are embedded into a base (1) without side distance; besides, each airproofing ring press correspondingly, thereby forming a self-airproofing and electrolyte airproofed cavity.

Description

technical field [0001] The present invention relates to an electroplating apparatus for so-called wafers. A wafer is a circular body with a planar geometry, which is commonly used in the field of semiconductor technology as a base for the manufacture of chips. Such wafers preferably consist of semiconductor materials of group 4 of the periodic table, such as silicon or germanium. Background technique [0002] Because the fourth period group in the chemical periodic table is located in the middle between the metal group of the first group and the non-metal group of the eighth group in the chemical periodic table, the elements of the fourth period group are neither ionically conductive metals nor ions Non-metals that do not conduct electricity, but quasi-semimetals with so-called ionic semiconductor properties. [0003] The properties of semiconductors have facilitated the development of modern technologies, whereby these functions can be implemented in the smallest spatial ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D7/12H01L21/228H01L21/445C25D17/00
CPCC25D17/00C25D7/12C25D17/001C25D17/004C25D21/12
Inventor 于尔根·古特孔斯特瓦希勒-阿德里安·博延
Owner 专用机械制造有限公司