Copper alloy material having high heat conductivity

Abstract

The invention is a high-heat conductivity copper alloy material, composed of the following components in weight percent: 0.0010%-0.0050% Li, 0.10%-0.20% Te and the rest Cu, using pure Cu, pure Li and pure Te as raw materials to make the alloy material by vacuum smelting. Its heat conductivity is 28% higher than pure red copper's, and 21% higher than pure silver's, and its conductivity is >=100% (IACS).

Description

1. Technical field [0001] The invention relates to alloys, especially the field of manufacturing copper alloy materials with high thermal conductivity and high electrical conductivity. 2. Background technology [0002] In today's era, electronic technology is advancing by leaps and bounds, and electronic components are developing rapidly. For example, more and more transistors are integrated on a chip, from large-scale integrated circuits to ultra-large-scale integrated circuits. The more transistors per unit area, the more energy is consumed, and heat dissipation becomes a big problem. It is estimated that 200 million transistors will be integrated on a chip in 2005, and it will be as hot as a "nuclear reactor". Level, if the number of integrated transistors is doubled by 2015, it will be as hot as the surface temperature of the sun. Therefore, the energy consumption and heat dissipation of ultra-large-scale chips will become a fundamental limitation, and become a big pro...

AI Technical Summary

Problems solved by technology

[0003] Among the existing heat-conducting metal materials, pure silver has the highest thermal conductivity (λ=405~414wm -1 k -1 ), followed by pure copper (λ=388~391wm -1 k -1 ), however, the existing conventional heat-conducting materials are facing the rapid development of high-tech industries, especially the challenges of the electronics industry, and can no longer meet the requirements for high-heat-conducting materials