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Composite LED package structure

A technology of light-emitting diodes and packaging structures, which is applied to semiconductor devices, electrical components, circuits, etc., and can solve problems such as high manufacturing costs, white light color accuracy, and attenuation

Inactive Publication Date: 2008-05-14
宋柏霖
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] But at present, no matter whether the blue light single chip is mixed with yellow phosphor powder to produce white light, or the three-wavelength light-emitting chip structure is used to mix white light, each has its own disadvantages.
For example, the phosphor powder used in the former will decay after a period of use, resulting in a problem with the color accuracy of the white light produced; while the latter needs to use chips with three wavelengths, and the manufacturing cost is relatively high.

Method used

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  • Composite LED package structure
  • Composite LED package structure
  • Composite LED package structure

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Embodiment Construction

[0035] see figure 1 and figure 2 , are respectively a preferred implementation mode of the compound light emitting diode packaging structure of the present invention before and after construction.

[0036] As shown in the figure, the composite LED packaging structure of the present invention includes two LED packaging parts, one is the upper LED packaging structure 2 and the other is the lower LED packaging structure 4 . It is characterized in that the LED chip 15 of the lower LED packaging structure 4 is connected to the tail of the LED chip 5 of the upper LED packaging structure 2 . The functions of their respective components will be described in detail below.

[0037] The upper LED packaging structure 2 includes an upper substrate 1 with a hollow structure 3 ; an upper LED chip 5 is located in the hollow structure 3 and covered and fixed therein by a transparent filler to form a cover 7 . The cover body 7 is made of light-transmitting material, so the packaging structu...

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Abstract

The invention discloses a packing structure of composite luminous diode, which consists of upper and lower luminous diode packing structures as an integral, wherein the upper luminous diode packing structure contains upper base with hollow structure and upper luminous diode transparent chip in the hollow structure fixed by translucent filler; the lower luminous diode packing structure contains lower base and lower luminous diode chip on the lower base, which is packed in the hollow structure with a translucent protective layer.

Description

technical field [0001] The invention relates to a packaging structure of a light emitting diode, in particular to a packaging structure of a composite light emitting diode. Background technique [0002] White light LED is the most promising LED emerging product, and its development potential in the lighting market is great. Compared with incandescent tungsten bulbs and fluorescent lamps, LEDs have small size (multiple pieces, multiple combinations), low calorific value (no heat radiation), low power consumption (low voltage, low current start), and long life (more than 10,000 hours), fast response (can be operated at high frequency), environmental protection (shock resistance, impact resistance, not easy to break, waste can be recycled, no pollution), can be flat packaged and easily developed into light, thin and short products, etc., no incandescent The disadvantages of light bulbs, such as high power consumption, fragility, and mercury pollution in fluorescent lamp waste,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L25/13H01L33/00H01L33/48
CPCH01L2224/8592H01L2224/48091H01L2924/00014
Inventor 宋柏霖
Owner 宋柏霖