Radiator heat transfer portion structure

Abstract

Being applicable for module of elimination in electronic equipment, a heat-conducting portion includes a heat conducting board and a buckling spring piece. At least a pillar of clip ring and a pillar of lockhole are setup on the surface, through which the heat-conducting board and the heating element are bound. The buckling spring piece is composed of a pair of clamping plate and a pair of structured board combined. Pawn holes at places corresponding to the pillar of clip ring, and lockholes at places corresponding to the pillar of lockhole are made on the clamping plate. Using the pillar of clip ring and the pillar of lockhole supports the buckling spring piece. The buckling spring piece are fixed and locked on pillars in order to clip a heating element. Thus, heating face of a heating element can be bound to the heat-conducting board.

Description

technical field [0001] The invention relates to a radiator heat conduction part structure, in particular to a radiator heat conduction part structure used in a heat dissipation module of a notebook computer for thermal conduction combination with a heating element. Background technique [0002] The circuit structure of a general notebook computer, for example, takes the central processing unit, south bridge chip, north bridge chip and display chip as the main calculation or control unit, because these chips often operate at high speed or perform a large number of calculations, so often Generate high temperature. In order to make related chips work at a normal operating temperature, the problem of heat dissipation is an important issue that notebook computers need to overcome urgently, because notebook computers are limited by lightness, thinness, shortness, smallness and internal space. Therefore, how to effectively use the space is particularly important in the circuit des...

AI Technical Summary

Problems solved by technology

[0005] The main position of the existing known heat sink is set on the central processing unit or the display chip of the main board, and the heat conduction plate of the heat sink is closely attached to the thermal surface of the central processing unit or the display chip. In order to achieve the effect of heat conduction and heat dissipation, however, the design of the display interface card in the current notebook computer tends to be a plug-in card design, so that the conventional heat dissipation device cannot be applied to the plug-in display card machine. type

[0006] It can be seen that the above-mentioned existing radiator heat transfer part structure obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

In order to solve the problems existing in the structure of the heat transfer part of the radiator, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure for general products to solve the above problems. This is obviously a problem that relevant industry players are eager to solve

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