Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

LED (light emitting diode) ceramic COB (chip on board) light source fluorescent lamp and preparation method thereof

A technology for fluorescent lamps and light sources, applied to circuit substrate materials, printed circuit parts, electrical components, etc., can solve problems such as high cost, poor chemical stability, and large light decay, reduce manufacturing processes and costs, and simplify installation and production and convenience, the effect of light distribution design of lamps and lanterns

Inactive Publication Date: 2013-08-07
YANCHUANG PHOTOELECTRIC TECH GANZHOU
View PDF3 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional method of LED lamps is: LED light source discrete device → MCPCB light source module → LED lamps, mainly based on the lack of applicable core light source components, which is not only labor-consuming and time-consuming, but also high cost
Moreover, the bracket is used as the package of the chip, which increases the manufacturing steps and cost of the light source. In addition, the metal substrate is used, which is not resistant to voltage shock and has a great safety hazard (<600V). The bracket and the metal substrate are insulated by polymer insulating film, which not only increases the heat Resistance and poor chemical stability, coupled with the high polymer material is not resistant to high heat, can not ensure the long-term life of the light source
In addition, the difference in thermal expansion coefficient between the metal substrate and the chip is too large, which can easily cause stress fatigue of the chip under long-term use and cause dead light
Therefore, traditional SMD LED lamps, commonly known as "Gypsophila", have many solder joints, many faults, more glare, low luminous efficiency (60-100ml / w), and large light decay (>3%)

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED (light emitting diode) ceramic COB (chip on board) light source fluorescent lamp and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A preparation method of LED ceramic COB light source fluorescent lamp is divided into the following steps:

[0022] The first step: the preparation of the ceramic substrate, select the prepared alumina ceramic plate, and use silver paste to screen the circuit on it. The amount of silver or silver alloy paste in the whole 1.2M lamp tube is 0.9g, and the laser cutting is obtained. The required size of the ceramic substrate, substrate width 12.5mm, that is.

[0023] Among them, the alumina ceramic plate is made by adding alumina with a mass fraction of 5% of silicon oxide, and then adding 35% of alcohol as a flux and 2% of polyphthalamide as a binder. Mix and grind for 24 hours to obtain the desired alumina body, and then sinter at 1550°C for 3 hours.

[0024] The silver paste is made of pure silver by sintering at 750°C for 1 hour.

[0025] The second step: carry out multi-chip integrated COB packaging, select the alumina ceramic substrate prepared in the first step, th...

Embodiment 2

[0029] A preparation method of LED ceramic COB light source fluorescent lamp is divided into the following steps:

[0030] The first step: the preparation of the ceramic substrate, select the prepared alumina ceramic plate, use the silver alloy paste to screen the circuit on it, the amount of the silver alloy paste in the whole 1.2M lamp tube is 1.0g, laser cutting to obtain the required The size of the ceramic substrate, the substrate width is 16mm, that is.

[0031] Among them, the alumina ceramic plate is made by adding alumina with a mass fraction of 5% of silicon oxide, and then adding 35% of alcohol as a flux and 2% of polyphthalamide as a binder. Mix and grind for 24 hours to obtain the desired alumina body, and then sinter at 1600°C for 3 hours.

[0032] The silver alloy paste is prepared by sintering at 800°C for 1 hour with pure silver plus bismuth borosilicate glass with a mass fraction of 9% as a binder.

[0033] All the other are with embodiment 1.

[0034] The...

Embodiment 3

[0036] A preparation method of LED ceramic COB light source fluorescent lamp is divided into the following steps:

[0037] The first step: the preparation of the ceramic substrate, select the prepared alumina ceramic plate, and use the silver alloy paste to screen the circuit on it. The amount of silver or silver alloy paste in the whole 1.2M lamp tube is 1.1g, and the laser cutting is obtained. The required ceramic substrate size, substrate width 16mm, that is.

[0038] Among them, the alumina ceramic plate is made by adding alumina with a mass fraction of 5% of silicon oxide, and then adding 35% of alcohol as a flux and 2% of polyphthalamide as a binder. Mixing and grinding for 24 hours, tape-casting to obtain the desired alumina body, and sintering at 1650°C for 3 hours.

[0039] The silver alloy paste is prepared by sintering at 850°C for 1 hour with pure silver plus bismuth borosilicate glass with a mass fraction of 15% as a binder.

[0040] All the other are with embod...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an LED (light emitting diode) ceramic COB (chip on board) light source fluorescent lamp and a preparation method thereof. A high-heat-conduction ceramic substrate is used for replacing the traditional metal packaging substrate, a multi-chip integration COB chip module applied to a fluorescent lamp bar is additionally used, and therefore the LED ceramic COM light source fluorescent lamp has the advantages of high lighting effect, high reliability and high quality; and a non-isolated power supply and all PC (personal computer) shells can be selected to lower the production cost so as to achieve the best cost performance. According to the LED ceramic COM light source fluorescent lamp disclosed by the invention, when the color temperature is 5700-6300K, a color rendering index exceeds 70, and the whole lamp lighting effect exceeds 1001m / w. The obtained fluorescent lamp has the advantages of low energy consumption, long service life and high lighting effect, and the production and application requirement scan be satisfied.

Description

technical field [0001] The invention relates to an LED fluorescent lamp and a manufacturing method thereof, in particular to an LED ceramic COB light source fluorescent lamp and a manufacturing method thereof. Background technique [0002] LED is a component made of semiconductor materials, and it is a new type of high-efficiency solid light source that can emit light with weak electric energy. The main features of LED are: long life, low energy consumption, high color rendering, easy maintenance, small size, DC drive, low driving voltage, fast lighting speed, no flicker, less glare, strong shock resistance, less heat generation, explosion-proof (no high-pressure components) and other characteristics, it is one of the most promising high-tech fields in the world in recent years. Due to the complex structure and process of LED packaging, which directly affects the performance and life of LEDs, it has been a research hotspot in recent years, especially the packaging of high-p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/64H01L33/52H05K1/03H01L25/075
Inventor 黄信二黄国忠吴国达郑吉峰廖进发
Owner YANCHUANG PHOTOELECTRIC TECH GANZHOU
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products