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Substrate with channel guide

A substrate and guide groove technology, applied to the circuit layout on the insulating board, the circuit layout on the support structure, the printed circuit connected with the non-printed electrical components, etc., can solve the problem that the glue 17 may retreat to the chip 12 corners, the chip 12 cannot operate normally, etc., to achieve the effect of protecting the chip

Inactive Publication Date: 2008-06-04
HIMAX TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the large area of ​​the vacant metal connection strips 15, 16 at the corners of the chip 12, when the glue 17 is coated between the corners of the chip 12 and the vacant metal connection strips 15, 16, the The glue 17 on the vacant metal connection pieces 15, 16 will shrink slightly towards the corner of the chip. Further, if subjected to subsequent heating process, the glue 17 may shrink to the corner of the chip 12, and If the corners of the chip 12 are not sealed with glue 17, moisture, dust, etc. may invade the chip 12 from this corner, making the chip 12 unable to operate normally

Method used

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  • Substrate with channel guide
  • Substrate with channel guide

Examples

Experimental program
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Embodiment Construction

[0013] see image 3 , which shows a schematic diagram of a substrate with guide grooves according to the present invention. The substrate 30 with guide grooves of the present invention includes: an effective surface 31 , a chip 32 and a plurality of metal connecting pieces 33 , 34 , 35 and 36 . The substrate 30 can be a flexible substrate or a flexible printed circuit board (Flexible Printed Circuit board, FPC), and its material can be polyimide (Polyimide, PI), but the substrate 30 is not limited to the above materials. In addition, the substrate of the present invention can be applied to a tape carrier package (Tape Carrier Package, TCP) or a chip on film bonding package (Chip On Film, COF).

[0014] The chip 32 and the metal connecting pieces 33 , 34 , 35 , 36 are arranged on the effective surface 31 . The metal connecting pieces 33 , 34 , 35 , 36 are divided into a plurality of wire metal connecting pieces 33 , 34 and at least one dummy metal connecting piece (Dummy Lead...

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Abstract

This invention relates to a base board with a guide channel including: an effective surface and multiple metal connecting plates, which are formed on the surface, each plate has a first surface and a second surface and the first surface is connected to said effective surface, at least one metal connecting plate has a guiding channel formed on the second surface, so that the glue sealing a chip and the metal connecting plates can surround the side and corners of the chip completely to prevent moisture or dust from intruding into said chip.

Description

technical field [0001] The invention relates to a substrate, in particular to a substrate with guide grooves. Background technique [0002] refer to figure 1 with figure 2 , which shows a conventional substrate schematic. The conventional substrate 10 includes: an active surface 11 , a chip 12 and a plurality of metal connecting pads 13 , 14 , 15 and 16 . The chip 12 and the metal connecting pieces 13 , 14 , 15 , 16 are arranged on the active surface 11 . The metal connecting pieces 13 , 14 , 15 , 16 are divided into a plurality of wire metal connecting pieces 13 , 14 and at least one dummy metal connecting piece (Dummy Lead) 15 , 16 . [0003] The chip 12 is roughly square and has a plurality of sides and a plurality of corners. Wherein the wire metal connection pieces 13 , 14 are arranged on the sides opposite to the chip, and the vacant metal connection pieces 15 , 16 are arranged on at least one corner opposite to the chip 12 . The wire metal connection pieces 13 ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H05K3/34H05K7/06
Inventor 林久顺曾伯强王甄瓅李佳颖
Owner HIMAX TECH LTD