Camera assembly

Abstract

An inexpensive camera module having good productivity is provided with a holding member 1 holding a lens 5; an image sensor 9 arranged oppositely to the lens 5; an insulating substrate 7 for supporting the rear surface of this sensor 9; and wires 10 for connecting an electrode 9b of the sensor 9 to a wiring pattern 8 provided on the insulating substrate 7. A lower cylindrical portion 3 of the holding member 1 has three outer walls 3a arranged in U-shape, and one partition wall 3b having a height lower than an outer wall 3a, and the almost all the wires 10 other than a wire 10 provided on one side of the sensor 9 and the sensor 9 excluding its one side are housed in the cylindrical portion 3. Accordingly, the only thing to do is to coat the wire 10 on the one side of the sensor 9 with an insulating resin portion 11, and thus, the inexpensive camera module in which an operation of forming the resin portion 11 is easy can be obtained.

Description

Technical field [0001] The present invention relates to a camera assembly suitable for use in electronic equipment such as mobile phones. Background technique [0002] Figure 4 Shows a cross-sectional view of the main parts of the existing camera assembly, if based on Figure 4 Describing the structure of the conventional camera module, the cylindrical holding member 51 has: an upper cylindrical portion 51a with a larger outer shape; and a lower cylindrical portion 51b connected to the upper cylindrical portion 51a, which is larger than the upper cylindrical portion 51a has a small external shape; and a mounting portion 51c, which is mounted with a lens 52, screwed into the upper cylindrical portion 51a. [0003] On an insulating substrate 53 composed of a flat plate, a wiring pattern 54 is provided, and the flat imaging element 55 is supported on the insulating substrate 53 underneath, and the electrode 56 is connected to the wiring pattern 54 by a wire 57 and is mounted on th...

AI Technical Summary

Problems solved by technology

[0007] Because of the existing camera module, because the outer peripheral portion of the imaging element 55 and all the lead wires 57 are exposed to the outside from the lower cylindrical portion 51b, the insulating resin portion 58 is provided on the entire outer peripheral portion of the lower cylindrical portion 51b, and all the lead wires 57 are exposed to the outside. Covered by the insulating resin part 58, there are problems in that the forming operation of the insulating resin part 58 is complicated, the productivity is poor, and the cost is increased.

Images