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Fluid controlling device and heat treating apparatus

A fluid control device and flow control technology, which is applied in the direction of using electric device flow control, valve device, feeding device, etc.

Inactive Publication Date: 2008-07-30
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But when Figure 11 In the gas supply system shown, since each gas pipeline a to c has a reversing valve 7, a filter 8, a pressure regulator 10, and a pressure sensor 9, the system cannot be sufficiently miniaturized.

Method used

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  • Fluid controlling device and heat treating apparatus
  • Fluid controlling device and heat treating apparatus
  • Fluid controlling device and heat treating apparatus

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Experimental program
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Embodiment Construction

[0031] Embodiments of the present invention will be described below based on the drawings.

[0032] figure 1 It is a system diagram showing an embodiment of a heat treatment apparatus having a fluid control device according to the present invention. The heat treatment device has a gas supply system including a fluid control device 11 and a reaction treatment furnace 32 . The reaction treatment furnace 32 accommodates a substrate and performs heat treatment such as oxidation treatment or CVD on the substrate, and a well-known suitable furnace can be used.

[0033] The fluid control device 11 includes a plurality of gas lines 12 , 13 , 23 arranged at equal intervals for supplying gas to the reaction treatment furnace 32 . Each gas line extends in a first vertical plane extending approximately vertically.

[0034] figure 1 The pipeline 12 at the middle left end is used to supply N 2 Wait for the purge gas line for purge gas P. A gas supply port 12a, a manual valve 12b, a ...

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PUM

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Abstract

A fluid control device, comprising a flow controller (13g) in a gas line (13), a pressure control system area (14) provided on the upstream side of the flow controller (13g) in the gas line (13), and an extension part (15) extending from the upstream side end of the gas line (13) in a direction orthogonal to the gas line (13), wherein supply sources of different types of processing gases A, B, and C are connected to the extension part (15).

Description

technical field [0001] The present invention relates to a fluid control device and a heat treatment device having the fluid control device. Background technique [0002] In the film formation process of the semiconductor manufacturing process, a combination of various gases is used to form a film on a semiconductor wafer. In the film forming process, it is often necessary to switch to use a variety of gases (for example, H 2 , O 2 、SiH 4 , N 2 etc.), or it is often necessary to use the same gas at different flow rates. [0003] Figure 10 It is a system diagram of a conventional gas supply system for supplying various gases into a reaction processing furnace of a semiconductor manufacturing apparatus. The gas supply system is composed of a plurality of processing gas lines a to d for supplying different gases, respectively, and a purge gas line p for supplying purge gas. [0004] A flow controller 1 such as a mass flow controller is installed in each of the processing ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/205G05D7/06F16K27/00F17D1/02B01J4/00C23C16/455H01L21/02F17D1/04
CPCF17D1/04C23C16/45557C23C16/52
Inventor 冈部庸之大仓成幸
Owner TOKYO ELECTRON LTD