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System and methods for packing, method for prosecuting turnkey services

A packaging method and packaging system technology, applied in the field of overall design services, can solve problems such as customer management difficulties

Active Publication Date: 2008-09-24
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And this reel full of "leftover dies" caused difficulties in customer management due to simultaneous loading of dies from wafer lots A, B, and C

Method used

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  • System and methods for packing, method for prosecuting turnkey services
  • System and methods for packing, method for prosecuting turnkey services
  • System and methods for packing, method for prosecuting turnkey services

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Embodiment Construction

[0026] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the preferred embodiments are specifically cited below, together with the attached drawings from Figure 3 to Figure 5B , give a detailed explanation. The description of the present invention provides different examples to illustrate the technical features of different implementations of the present invention. Wherein, the configuration of each element in the embodiment is for illustration, not for limiting the present invention. In addition, part of the symbols in the figures in the embodiments are repeated for the purpose of simplifying the description, and do not imply the relationship between different embodiments.

[0027] FIG. 3 shows a schematic diagram of a supply chain system according to an embodiment of the present invention. The supply chain system 30 includes a semiconductor manufacturer 31 , a contractor 33 and a client 35 . According to a...

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Abstract

A system of packing for turnkey services. An input port receives first and second wafer lots from a semiconductor manufacturer. The first wafer lot comprises a first number of dies, and the second wafer lot comprises a second number of dies. A packing device loads dies of the first wafer lot in a provided carrier having a preset capacity, and each of the loaded carriers is filled to capacity. A controller determines whether there is a remaining die of the first wafer lot that cannot fill one of the carriers, and directs the packing device to load the remaining dies of the first wafer lot and dies of the second wafer lot sequentially. The invention solves the problem which the turnkey services loads differernt lots of wafer at the same time cause difficult to client manage.

Description

technical field [0001] The present invention relates to semiconductor manufacturing, and more particularly to methods and systems for performing turnkey services. Background technique [0002] At present, when a large number of dies are transported, a tape-on-reel is often used to carry the dies, which is as follows figure 1 shown. A plurality of dies 11 are fixed on a tape-shaped carrier 12 of a reel. The strip cover 13 covers the die 11 to provide protection for the die. The tape carrier 12 on which the die 11 is fixed is wound up on a tape reel 14 . The number of dies that each reel 14 can carry depends on the width of its tape carrier and the size of the dies. As far as crystal grains of a specific size and a tape-shaped carrier of a specific width are concerned, the number of crystal grains that can be carried by it is certain. [0003] When shipped, die belonging to the same wafer lot are usually packaged together, and each reel is loaded to its full capacity. Fo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65B15/04B65B57/00
CPCH01L21/67271H01L21/67276H01L21/67333H01L21/67132
Inventor 蔡荣翼张朝兴黄文赐
Owner TAIWAN SEMICON MFG CO LTD
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