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Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates

A technology of microelectronics and substrates, applied in chemical instruments and methods, grinding devices, other chemical processes, etc., can solve problems such as capacitor short circuit and capacitor failure

Inactive Publication Date: 2008-11-12
MICRON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] One disadvantage of the aforementioned container technology used to form capacitors is that during the CMP process, small particles of conductive material removed from the conductive layer can become embedded in the photoresist material in the holes
Embedded conductive material can cause shorts and / or other defects in capacitors subsequently formed in the holes, causing capacitor failure
An additional disadvantage is that a high down force is usually required in the CMP process to remove the conductive material outside the hole

Method used

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  • Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
  • Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
  • Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates

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Embodiment Construction

[0018] One approach (developed by the assignee of the present application) for addressing the aforementioned shortcomings associated with container handling is to replace the traditional soft materials used to fill containers with hard materials. For example, conventional photoresist materials can be replaced with phosphosilicate glass (PSG) or spin-on glass (SOG), and can be placed in platinum-lined containers. Further details of materials and processing according to this approach are disclosed in US Patent Application 10 / 230,628, previously incorporated herein by reference.

[0019] One problem typified by the use of platinum wire, PSG filled vessels, is that relatively high CMP down force is required to remove the platinum outside the vessel, which can cause platinum to coat into the area between adjacent vessels, even if the platinum is not embedded In PSG. Another problem is that existing polishing fluids tend to remove platinum and PSG non-uniformly. Such polishing liq...

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Abstract

Method and apparatus for chemically, mechanically and / or electrolytically removing material from microelectronic substrates. A polishing medium for removing material can include a liquid carrier, an electrolyte disposed in the liquid carrier, and abrasives disposed in the liquid carrier, with the abrasives forming up to about 1% of the polishing liquid by weight. The polishing medium can further include a chelating agent. An electrical current can be selectively applied to the microelectronic substrate via the polishing liquid, and a downforce applied to the microelectronic substrate can be selected based on the level of current applied electrolytically to the microelectronic substrate. The microelectronic substrate can undergo an electrolytic and nonelectrolytic processing on the same polishing pad, or can be moved from one polishing pad to another while being supported by a single substrate carrier.

Description

[0001] Cross References to Related Applications [0002] This application is related to the following pending U.S. patent applications, all of which are incorporated herein by reference: 09 / 651,779, filed August 30, 2000; 09 / 888,084, filed June 21, 2001; 09 / 887,767, filed June 2001 09 / 888,002, filed 21 June 2001. This application is also related to the following US patent applications, which were concurrently filed and incorporated herein by reference: 10 / 230,970; 10 / 230,972; 10 / 230,973; and 10 / 230,628. technical field [0003] The present invention generally relates to methods and apparatus for chemically, mechanically and / or electrolytically removing material from microelectronic substrates. Background technique [0004] Microelectronic substrates and substrate assemblies typically include semiconductor materials having features, such as memory cells, connected to wires. The wires may be formed by first forming a trench or other recess in the semiconductor material and t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K3/14H01L21/321H01L21/3105H01L21/3063B24B37/04C09G1/02H01L21/304
CPCH01L21/32125B24B37/044B24B37/046C09G1/02H01L21/3212C09K3/1463H01L21/304
Inventor 沃恩集·李斯科特·G·米克尔
Owner MICRON TECH INC