External pin lens semiconductor packaging structure and its manufacturing method
A manufacturing method and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve problems such as inability to meet high-power heat dissipation
Active Publication Date: 2008-11-26
ADVANCED SEMICON ENG INC
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Problems solved by technology
However, currently available leadless package configurations cannot meet the high power dissipation requirements of automotive, industrial and commercial applications.
Method used
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[0026] In order to make the above and other objects, features, and advantages of the present invention more apparent, the following specifically cites embodiments of the present invention, together with accompanying figures, for a detailed description as follows.
[0027] refer to image 3 , which shows a top view of a lead frame according to an embodiment of the present invention. The lead frame 100 includes a plurality of units separated by a plurality of dambars. Although only one leadframe 100 unit is shown in image 3 , but the lead frame used in the present invention may contain any number of units suitable for the manufacturing equipment used, such as mold equipment. The embankment usually forms an orthogonal lattice on the lead frame 100 . The lead frame 100 is generally made of copper-based alloys, copper, or copper-containing alloys. The lead frame 100 has a thickness between 10 μm and 20 μm, and is formed by etching each unit of the lead frame 100, wherein the u...
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The invention relates to a semiconductor package structure, comprising a semiconductor device firmly adhering to the upper surface of a chip base through tin paste and plural pins arranged near around the chip base, where the thicknesses of the chip base and pins are between 10 um-20 um, the semiconductor device is connected to one pin, a sealing colloid is formed on the semiconductor device and the pins, the lower surfaces of the chip base and the pins are exposed through the sealing colloid, and for better, the semiconductor device is connected to one pin through at least a large-sized aluminum wire. The invention additionally provides a method for manufacturing the semiconductor package structure.
Description
technical field [0001] The invention relates to a semiconductor packaging structure without external leads, in particular to a semiconductor packaging structure without external leads and a manufacturing method thereof. Background technique [0002] In the packaging history of integrated circuits, the lead frame packaging structure has been used for a long time, mainly because of its low manufacturing cost and high reliability. However, as integrated circuit products continue to strive towards the goal of high speed and small size, the traditional lead frame packaging structure has gradually been eliminated for some packaging structures that require high performance. Therefore, Ball Grid Array (BGA) package structure and Chip Size Package structure (Chip Size Package) have emerged, and become another new package option that is becoming more and more popular. The former has been widely used in integrated circuit chips, where the chip has a higher number of input / output, and ...
Claims
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IPC IPC(8): H01L25/00H01L21/50H01L21/60
CPCH01L2924/01015H01L2224/45124H01L2924/01046H01L24/49H01L2924/0105H01L2924/01082H01L2924/01047H01L2924/01079H01L2924/01049H01L2224/32245H01L2224/49051H01L2224/48247H01L2924/14H01L2224/4903H01L2924/01005H01L2924/01006H01L2924/01029H01L2924/01078H01L2224/48472H01L2924/01028H01L2224/48091H01L2924/01083H01L2224/49171H01L2224/73265H01L2924/014H01L2924/01013H01L2924/181H01L2224/05554H01L2224/0603H01L2224/49H01L2924/00014H01L2924/00H01L2924/00012
Inventor 寇宽旺金颂悟卜桑贝
Owner ADVANCED SEMICON ENG INC