Exposure device and exposure method

Abstract

An exposure device in which accuracy in a substrate and a mask film is not made different in each adjustment work of temperature and humidity, can be adjusted responding to the influences of a transportation passage and environmental changes in the exposure device, and detection of temperature and humidity and supply of temperature- and humidity-adjusted air can be performed at an appropriate position even when the exposure device is equipped with a pre-alignment part, and an exposure method, are provided. The exposure device (1) is equipped with an exposure part (20, 40) which conveys a substrate (W) onto an exposure table (21) disposed at a position opposing to an exposure frame holding a mask film (M) and carries out exposure processing of the substrate, and a pre-alignment part (10) which is disposed just prior to the exposure part and preliminarily positions the substrate by a push pin moving section (14b) which pushes and moves the end face of the substrate. The device (1) is further equipped with a temperature control means (61A), a humidity control means (65A), a substrate temperature and humidity detecting means (16), a mask temperature and humidity detecting means (24), and a temperature and humidity control means (82).

Description

Technical field [0001] The present invention relates to an exposure device and an exposure method for forming a predetermined pattern via a mask film on a substrate such as a printed substrate or a substrate for liquid crystal. Background technique [0002] In general, it has been known that substrates such as printed circuit boards and photomask films are greatly affected by environmental conditions such as temperature and humidity in the exposure section of the exposure device. According to the characteristics of laminates (substrates) made of various resins in "Table 2.5.3" described in the second edition of the Handbook of Printed Circuit Technology, one of the representative substrates is BT resin, and its temperature characteristics are expressed as: The direction is 1~1.5×10 -5 m / cm / ℃, 4~5×10 in Z direction -5 m / cm / °C. And, in the 1046 page, it is stated that the temperature characteristic of the mask film is 1×10 -3 % / ℃, humidity characteristic is 1.4×10 -3 % / ℃. That is, ...

AI Technical Summary

Problems solved by technology

[0011] However, in the configuration of the exposure apparatus described in Patent Document 1 or Patent Document 2, the temperature of the precalibration part and the temperature of the exposure part are controlled to be substantially the same temperature, but since the target mask is adjusted for the glass material, it is completely Humidity is not considered

Therefore, in the conventional exposure device, since the humidity of the pre-alignment part is different from that of the exposure part, it is difficult to accurately align the mask film and the substrate in the exposure part. Waiting for the same humidity conditions, but the alignment operation cannot be performed until the humidity conditions are complete, which has the disadvantage of being impractical in terms of exposure efficiency

In other words, in the structure of the exposure device using a photomask film, not only the temperature of the pre-alignment part and the exposure part, but also the humidity must be controlled to the same condition, otherwise the alignment between the photomask film and the substrate cannot be quickly performed, making it an obstacle important factor in productivity

[0012] In addition, in the structure of the exposure apparatus described in Patent Document 3, since only the temperature / humidity control of the exposure part is performed, it is costly to adjust the photomask film that is easily affected by temperature and humidity and the substrate that is affected by different temperature and humidity from the photomask film. time, but the alignment between the photomask film and the substrate still takes time

Then, in the structure of Patent Document 3, although the humidity and temperature of the exposure part can be adjusted correspondingly, since the mask film is adjusted corresponding to each substrate, the expansion and contraction state of the substrate or the expansion and contraction state of the mask film is adjusted each time. Adjustments must be made every time, so the accuracy of the substrate and the mask film will not be avoided in each unit that performs the adjustment work.

[0013] Moreover, in the structure of the pre-calibration part, since each structure such as the handler (handler) and the pre-positioning mechanism for adsorbing and transporting the substrate is movable, although it is necessary to detect the temperature and humidity at an appropriate position, in the above-mentioned patent documents The structure of the pre-calibration part is not fully described

Moreover, in the pre-calibration section and the exposure section, when the substrate or the photomask film is supplied with temperature and humidity, at the movable positions of each structure, efficiency and dust must be taken into consideration, which cannot be achieved as in Patent Document 1 or Patent Document 1. 2, adjust the temperature at a newly installed position other than the exposure table

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