Method for mfg. plasma display

A technology of plasma and manufacturing method, applied in the manufacture of discharge tube/lamp, cold cathode manufacture, tube/lamp screen manufacture, etc., can solve the problems of poor crimping effect, uneven heating, broken glass substrate, etc. Achieve the effect of improving crimping efficiency and success rate, high bonding strength, and preventing damage

Inactive Publication Date: 2009-01-14
四川世纪双虹显示器件份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing plasma manufacturing method only heats the surface of the glass substrate with the FPC film, and the heating is uneven; some technologies do not perform pre-pressing, but directly press the ACF film on the glass substrate and then directly press it.
In this way, it is easy to cause the glass substrate to break during crimping, the crimping effect is not good, it is not firm, the resistivity of the crimping point is relatively large, and the success rate is low

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] First, the anisotropic conductive film ACF film is pasted on the printed electrode of the glass substrate; then, the glass substrate with the anisotropic conductive film ACF film is placed on a crimping machine for low-temperature pre-pressing, and the glass substrate is heated up and down at the same time. The temperature is 100℃, the pressure is 5Kg / cm 2 ; Secondly, peel off the upper layer of the anisotropic conductive film ACF film, and retain the adhesive layer of the anisotropic conductive film ACF film; paste the flexible circuit board film FPC film on the printed electrode of the glass substrate with the anisotropic conductive film ACF film, and then apply The glass substrate is heated up and down at the same time, the temperature is 80℃, and the pressure is 4~6Kg / cm 2 ; When the plasma glass substrate is heated, a rubber elastic soft gasket is placed on the heated glass substrate. Put the place where the FPC film of the flexible circuit board is attached to th...

Embodiment 2

[0018] First, the anisotropic conductive film ACF film is pasted on the printed electrode of the glass substrate; then, the glass substrate with the anisotropic conductive film ACF film is placed on a crimping machine for low-temperature pre-pressing, and the glass substrate is heated up and down at the same time. The temperature is 80℃, pressure is 6Kg / cm 2 ; Secondly, peel off the upper layer of the anisotropic conductive film ACF film, and retain the adhesive layer of the anisotropic conductive film ACF film; paste the flexible circuit board film FPC film on the printed electrode of the glass substrate with the anisotropic conductive film ACF film, and then apply The glass substrate is heated up and down at the same time, the temperature is 100℃, and the pressure is 4~6Kg / cm 2 ; When the plasma glass substrate is heated, a rubber elastic soft gasket is placed on the heated glass substrate. Put the place where the FPC film of the flexible circuit board is attached to the cr...

Embodiment 3

[0020] First, the anisotropic conductive film ACF film is pasted on the printed electrode of the glass substrate; then, the glass substrate with the anisotropic conductive film ACF film is placed on a crimping machine for low-temperature pre-pressing, and the glass substrate is heated up and down at the same time. The temperature is 110℃, pressure is 4Kg / cm 2 ; Secondly, peel off the upper layer of the anisotropic conductive film ACF film, and retain the adhesive layer of the anisotropic conductive film ACF film; paste the flexible circuit board film FPC film on the printed electrode of the glass substrate with the anisotropic conductive film ACF film, and then apply The glass substrate is heated up and down at the same time, the temperature is 110℃, and the pressure is 4~6Kg / cm 2 ; When heating the plasma glass substrate, a plastic elastic soft pad is placed on the heated glass substrate. Put the place where the FPC film of the flexible circuit board is attached to the crimp...

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PUM

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Abstract

This invention discloses a manufacture method for a plasma indicator, which adheres an ACF on a printed electrode of a glass base plate and puts the base plate on a crimp machine for pre-pressing the both sides at low temperature at the same time, then takes out the top layer of the ACF to keep its adhesion layer, a flexible PC film is adhered on the ACF of the printed electrode of the glass base plate then heats the both sides of the base plate at the same time and presses the place for placing the FPC film on the crimp machine tightly, finally, seals the FPC film and the glass base plate with a non-corrosive glue.

Description

technical field [0001] The present invention relates to a manufacturing method of a plasma display. Background technique [0002] In recent years, plasma display devices have been attracting attention as display screens with excellent visibility, and have been developed toward higher definition and larger screens. [0003] The plasma display device can be roughly classified into an AC type and a DC type as a driving method, and there are two types of discharge types: a surface discharge type and an opposite discharge type. At present, AC type and surface discharge type plasma display devices are the mainstream, and their development direction is gradually developing towards high definition and large screen. [0004] The existing plasma manufacturing methods only heat the surface of the glass substrate with the FPC film attached, and the heating is not uniform; some technologies do not perform pre-pressing, but directly press the ACF film on the glass substrate directly. In...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J9/00H01J11/00H01J17/49H05K3/36H01J9/20
Inventor 姜凤山邢懋腾徐世文
Owner 四川世纪双虹显示器件份有限公司
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