Stack type chip packaging structure, chip packaging body and manufacturing method

Abstract

This invention relates to chip sealing part, which comprises one flexible circuit board, one first and second chip, wherein, the flexible circuit board is bent to form one containing space; first and second chips are set on flexible circuit; the first and second chips are contained in one space with first one upon second one; this invention chip thickness can change. This invention provides one overlap chip sealing structure and its process method.

Description

technical field [0001] The present invention relates to a package structure, and more particularly to a stacked chip package structure with high package density. Background technique [0002] In today's information society, users are pursuing high-speed, high-quality, and multi-functional electronic products. In terms of product appearance, the design of electronic products is also moving towards the trend of light, thin, short and small. In order to achieve the above goals, many companies incorporate the concept of systemization when designing circuits, so that a single chip can have multiple functions, so as to save chips configured in electronic products (chips are chips, hereinafter referred to as chip) number. In addition, as far as electronic packaging technology is concerned, in order to meet the design trend of light, thin, short, and small, the packaging design concept of multi-chip module (MCM), chip scale package (chip scale package, etc.) have also been develop...

AI Technical Summary

Problems solved by technology

[0004] Since the chips 120a and 120b must be separated by a certain distance to facilitate the wire bonding process, the overall thickness of the conventional stacked chip package structure 100 cannot be further reduced due to the thickness of the spacer 130

In addition, the conventional stacked chip packaging structure 100 also has problems in heat dissipation.

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