Denting test method of anisotropic conductive film

Abstract

PROBLEM TO BE SOLVED: To provide an impression inspection method of an anisotropic conductive film capable of heightening productivity. SOLUTION: This impression inspection method for determining existence of a connection defect of a component on which the anisotropic conductive film is press-bonded is performed as follows: each component of TAB, FOG and a chip is temporarily press-bonded by a contact force of the anisotropic conductive film; a component material finally press-bonded by a tool is supplied to an inspection stage, and the second camera is focused onto the surface of the conductive film; the inspection stage on which the component material is placed is aligned by an alignment signal; the inspection stage is transferred to a primary inspection position by a signal from a PLC control part, and an impression on the component material is captured as an image by the second camera; the inspection stage is furthermore transferred to a secondary inspection position; simultaneously the captured impression image is inspected by an algorithm, and the inspection stage is transferred; thereafter, when the transferred position is not the last inspection position, impression image inspection is repeated; and when the transferred position is the last inspection position, the impression image inspection is finished, and the component material is discharged.

Description

technical field [0001] The invention relates to an indentation inspection method of an anisotropic conductive film. Specifically, the adhesive force of the anisotropic conductive film is used to pre-press the component material on the surface of the film, and a high-temperature, high-pressure tool (tool) is used. Crimping is performed, and the indentation generated during the crimping process is extracted as an image, and the process of inspecting the above-mentioned indentation image while the part is conveyed to the inspection position is repeated, thereby reducing the time required for inspection and improving productivity. , and block the process after the production of bad products, reducing the loss of materials. Background technique [0002] In general, in the field of liquid crystal display (LCD: Liquid Crystal Display) panel mounting, the connection between LCD panel and thin film package [TCP (Tape Carrier Package)] or printed circuit board [PCB (Printed Circuit Bo...

AI Technical Summary

Problems solved by technology

[0005] In the inspection process of the above-mentioned connection state, if the state cannot be checked correctly, the next process will be carried out, resulting in material loss and working in a bad state

As a solution to the above problems, manual inspection with the naked eye or a microscope tool can be implemented, but for smooth inspection, a lot of manpower is required and a lot of time is required, so productivity is reduced

Images