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Heat radiator

A technology of heat dissipation device and heat dissipation plate, which is used in cooling/ventilation/heating transformation, instrument cooling, instrument and other directions, which can solve the problems of small space, inconvenient installation of radiators, and narrow spacing between adjacent boards.

Inactive Publication Date: 2009-07-22
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, due to the dense distribution of components on the board, the space is small and the distance between adjacent boards is narrow, it is inconvenient to install a heat sink on it, and it is very easy to interfere with the operation of adjacent boards due to the installation of a heat sink on a board , making it difficult to install and disassemble the radiator

Method used

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  • Heat radiator
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Embodiment Construction

[0014] Please refer to FIG. 1 , the heat dissipation device of the present invention includes a circuit board 10 , a first heat dissipation plate 20 attached to both sides of the circuit board 10 , a second heat dissipation plate 30 , and the circuit board 10 is clamped between the first and second heat dissipation plates 20 . Four clips 40 between 30.

[0015] Please refer to FIG. 2 to FIG. 4 at the same time. The circuit board 10 is in the shape of a rectangular plate, including a plurality of heating electronic components 50 attached to the front surface and a main heating electronic component 52 attached to the rear surface. A pair of notches 12 are formed on both ends of the circuit board 10 . The first and second heat sinks 20, 30 are rectangular plates and attached to both sides of the circuit board 10. The outer sides of the first and second heat sinks 20, 30 facing away from the circuit board 10 are respectively provided with four pairs of " U"-shaped protruding port...

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Abstract

A heat dissipation device includes a pair of heat dissipation plates and a clamping piece clamping the two heat dissipation plates on both sides of a circuit board. The clamping piece includes a connecting portion and a pair of elastic clamping portions extending from both ends of the connecting portion. , one side of one cooling plate accommodates a heat pipe, and the opposite ends of the two cooling plates are fastened to each other. A first groove for accommodating the heat pipe is provided on one side edge of the heat dissipation plate of the heat pipe, and a second groove for receiving a heat-generating electronic component on the circuit board is provided above the first groove. In the present invention, a heat pipe is arranged in the heat dissipation plate, and the heat of the heating electronic components is quickly transferred to the heat dissipation plate through the heat pipe, so that the heat dissipation efficiency is remarkable; the heat pipe is embedded in one side of the heat dissipation plate, and has a compact structure and saves space.

Description

【Technical field】 [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for cooling electronic components on a circuit board. 【Background technique】 [0002] With the continuous development of the computer industry, the operating frequency and speed of electronic components such as central processing units and sound cards continue to increase, and the heat generated is increasing. If the heat is not dissipated in time, the accumulated heat will cause the temperature to rise and affect the normal operation of electronic components. . [0003] With the improvement of computer performance, the capacity of chips on boards such as memory sticks and graphics and sound cards is increasing day by day, the size is getting smaller and smaller, and the working speed is getting faster and faster. The heat generated in this process is constantly increasing. How to quickly replace the chips on these additional cards? Rapid and effective hea...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/367G06F1/20G12B15/00
Inventor 赖振田周志勇丁巧利
Owner FU ZHUN PRECISION IND SHENZHEN