Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for checking flat medium with pattern and its equipment

A pattern and medium technology, applied in the direction of measuring devices, image analysis, image data processing, etc., can solve problems such as single fit, inefficient use of system resources, and inability to completely filter out, and achieve the effect of improving cycle time efficiency

Inactive Publication Date: 2009-07-29
ORBOTECH LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] As with any of the above methods, using a single suitable (relatively low) resolution to scan the surface of the object being inspected will lead to a set of possible disadvantages
These possible disadvantages must include both legitimate disadvantages and false alarms, since these methods cannot completely filter out expected changes between test and reference images
This results in an inefficient use of system resources within a given time limit

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for checking flat medium with pattern and its equipment
  • Method for checking flat medium with pattern and its equipment
  • Method for checking flat medium with pattern and its equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] refer to figure 1 , which shows some of the possible defects that can be found during LCD panel manufacturing. These defects include metal bumps 110 protruding into the ITO layer 112, ITO bumps 114 protruding into the metal 116, so-called rat bite cracks 118 in the metal 112, open circuits 120 in the metal 116, cracks in the transistor 122 of the pixel. Transistor shorts 124, and foreign particles 126 in any areas. Each type of these defects must be checked, classified and repaired where possible.

[0037] According to the invention, the inspection platform 10 ( Figure 2A or 2B) Equipped with Defect Review Subsystem (DRS) 12 . DRS 12 includes a plurality of substantially identical higher resolution imaging optics and photoelectric transducers that together form a set of camera modules 14, 16, 18 that are capable of being inspected along with defects on a gantry 20 The scanning motion of the subsystem (DDS) 24 moves together along the length of the inspected object ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention discloses a concurrent low-resolution / high-resolution parallel scanning system and method as an improvement to the scanning process of inspection systems for flat objects such as large flat panels used in flat panel displays, The low resolution defect detection phase is thereby effectively overlapped and paralleled with the high resolution defect review and classification phase where defects are automatically defined and resolved. While the present invention is an effective solution to the more general problem of optically inspecting the surface of flat objects for defects, it is useful for detecting pattern defects on large glass plates on which integrated circuits are deposited for forming LCD flat panel displays. Very useful.

Description

[0001] Cross References to Related Applications [0002] This application is a continuation of U.S. Patent Application Serial No. 10 / 439,991, filed May 16, 2003, which claims the benefit of the filing date of U.S. Provisional Application Serial No. 60 / 423.008, filed November 1, 2002, The entire content of the latter is hereby incorporated by reference. technical field [0003] This invention relates to the general field of machine observation based inspection techniques, and more particularly to machine observation based detection and classification of defects occurring on large, patterned, flat surfaces. In particular, the present invention addresses the inspection of materials deposited on large substrate glass plates such as liquid crystal display (LCD) panels. Although the invention is applicable in general to the inspection of any patterned flat media, the invention is particularly concerned with the inspection of glass substrates for preformed thin film transistor (TFT)...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/956G06T7/00
Inventor 亚当·韦斯阿夫沙尔·萨兰勒
Owner ORBOTECH LTD