Reconfigurable chassis module

A casing and modular unit technology, applied in the field of reconfigurable casing modules, can solve the problems of internal component maintenance service difficulties, hindering the degree of casing modularization, and long time, so as to speed up the market speed, reduce weight and Cost, the effect of reducing development cost

Inactive Publication Date: 2009-07-29
HUANDA COMPUTER (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Furthermore, the traditional case design includes a multi-piece composite structure of metal sheets, which hinders the degree of modularization of the case
And the traditional design also makes repair service of internal components difficult and must take a long time to complete

Method used

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Examples

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Embodiment Construction

[0018] Please refer to figure 1 , figure 2 , image 3 and Figure 4 . The computer system of the present invention includes necessary hardware units, such as: a main board 30, an interposer board 40, a power supply module 50, fans 61, 62, 63 and an intermediary board 70, which are respectively arranged on the first module unit 10 of the chassis module and the second modular unit 20 .

[0019] The motherboard 30 is a printed circuit board configured with different circuit components, such as: a central processing unit (CPU), a system memory, a north-south bridge chip, an input / input controller, a network interface controller, and an input / input connector. Components are connected to a specific bus and perform data processing work under the operating system. The interposer 40 provides additional functions and compatibility of the computer system, and has different interfaces under different operation implementations. According to the computer system of the present inventi...

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Abstract

A reconfigurable casing module forms an upgradable computer system with several hardware units and one or more intermediary boards. The casing module includes several modular units for respectively installing hardware units. Each modular unit has a dedicated frame for mounting a sub-board or a dedicated fan. The interface board is used to connect the scattered hardware units between the modular units. Each modular unit is provided with matching male and female joints for mutual engagement. Specific fixing assemblies ensure a male-to-male joint or a female-to-female joint, allowing the modular units to be connected front-to-back and / or side-to-side.

Description

【Technical field】 [0001] The invention relates to a casing design of an electronic device, in particular to a reconfigurable casing module of an upgradeable computer system. 【Background technique】 [0002] The enclosure design of traditional electronic devices requires a fixed and pre-set integral support enclosure to provide mechanical support for the internal electronic components. This limitation prevents some reconfigurable options from being part of the basic design of the overall enclosure and internal structure. In general, any system that does not require total reconfigurability has unnecessary weight, unused spare space, and unnecessary expense. As future technology develops, the mechanism design may not be able to comply with the new form factor, and a new case may need to be redesigned to support the technology features, which will require additional costs. For example: new central processing unit (CPU) and memory upgrades require new power supplies or new inter...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18
Inventor 李宠平井智则钟志明
Owner HUANDA COMPUTER (SHANGHAI) CO LTD
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