Integrate circuit system pressing impedance detection method

Abstract

The present invention relates to a method for detecting pressure bonding impedance of an integrated circuit system, which includes: providing an integrated circuit system, which includes a first integrated circuit and a second integrated circuit electrically connected to the first integrated circuit, the first integrated circuit The two pins of the circuit and the two pins of the second integrated circuit correspondingly connected to each other form two branches, and each branch is composed of a plurality of pressing impedances connected in series; the two pins of the first integrated circuit are short-circuited, so that The two branches and the designed internal resistance of the integrated circuit system form a series circuit; a test voltage is input at the first pin of the second integrated circuit, and a feedback voltage is detected at the second pin of the second integrated circuit , by judging the magnitude of the feedback voltage to determine whether the pressing impedance of the integrated circuit system is qualified. The above method for detecting the bonding impedance of the integrated circuit system is used to detect the bonding impedance of the integrated circuit system, so as to ensure the reliability of signal transmission of electronic equipment using the integrated circuit system.

Description

technical field [0001] The invention relates to a method for detecting pressure bonding impedance of an integrated circuit system. Background technique [0002] Currently, integrated circuits are widely used in various electronic devices due to their advantages of small size, high integration, and convenient connection. Especially in liquid crystal display devices, integrated circuits are more widely used in liquid crystal panel drive devices. Generally, a liquid crystal panel includes two opposite substrates and a liquid crystal layer sandwiched between the two opposite substrates, and circuit structures such as scanning lines, data lines, thin film transistors, and common electrodes are arranged on the surface of one substrate. In order to drive the above circuit structure, the industry often uses COG (Chip On Glass, Chip On Glass) bonding (Bonding) technology and COF (Chip On Film, Chip On Film) bonding technology to integrate integrated circuits, glass substrates, printe...

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem that the bonding impedance of the integrated circuit system cannot be measured in the prior art, it is necessary to provide a method for detecting the bonding impedance of the integrated circuit system that can detect whether the bonding impedance of the integrated circuit system is qualified.

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