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Coating method and coating device

A coating method and a coating device technology, which can be applied to devices, coatings, electrical components and other directions for coating liquid on the surface, and can solve problems such as difficult to wet lines.

Inactive Publication Date: 2009-09-23
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the conventional coating apparatus of this type, there is a problem that it is difficult to obtain a horizontal straight line WL constantly, and wavy bends are likely to be formed depending on the type of resist liquid. lunar surface, such as Figure 13 As shown, a streak-like coating spot 204 along the scanning direction is generated at a position on the substrate G corresponding to the crest portion 202 of such a wavy meniscus.

Method used

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Embodiment Construction

[0030] Refer below Figure 1 to Figure 12 Preferred embodiments of the present invention will be described.

[0031] exist figure 1 In , a coating and developing treatment system is shown as an example of the configuration to which the coating method and coating apparatus of the present invention can be applied. The coating and development processing system 10 is set in a clean room, and takes, for example, an LCD substrate as a substrate to be processed. In the LCD manufacturing process, the photolithography process performs cleaning, coating resist, pre-baking, developing and post-baking. A series of processing such as roasting. Exposure processing is carried out in an external exposure device 12 arranged adjacent to the processing system.

[0032] In this coating and development processing system 10, a horizontally long processing station (P / S) 16 is arranged at the center, and a box station (C / S) 14 and an interface station are arranged at both ends of the longitudinal...

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Abstract

As stability always obtains a wet line good for a long-type coating nozzle, on a processed substrate, a film thickness is fixed and a coating film without coating unevenness is formed. The wet line ground processing part 125 supplying resist liquid or dilution resist liquid to the coating pad 162 constituted so that resist .liquid might ooze from the front from the resist liquid supply part in the utility unit 172. Pushing the coating pad 162 against the bottom half part of the nozzle part back 160 by predetermined pressure by pushing parts in the utility unit 172. The application pad 162 is made to move in the direction of nozzle longitudinal (the direction of Y) by the going-straight drive of the going-straight drive part 176 at linear from the end of the resist nozzle 120 to other ends, and a breath.

Description

technical field [0001] The invention relates to a coating method and a coating device for coating a liquid on a substrate to be processed to form a coating film by using a strip-shaped nozzle. Background technique [0002] At present, in the photolithography process in the manufacturing process of LCD and semiconductor devices, etc., it is a form of resist liquid nozzle used to apply resist liquid on the substrate to be processed (glass substrate, semiconductor wafer, etc.) , for example, a long resist liquid nozzle having a slit-shaped discharge port disclosed in Patent Document 1 is known. [0003] In a resist coating apparatus using such a long nozzle, such as Figure 13 As shown, a small gap of several hundred μm or less is set between the substrate G horizontally placed on the mounting table or holding plate (not shown) and the discharge port of the lower end surface of the elongated resist nozzle 200, Above the substrate G, the resist liquid is discharged on the subst...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05D1/26B05D1/40B05D3/00B05C5/02B05C9/08B05C1/06B05C11/00H01L21/027
CPCB05C5/02B05D1/26B05D1/40
Inventor 河野幸弘田中志信
Owner TOKYO ELECTRON LTD