Display panel, its pin joint and detecting method

Abstract

The invention discloses a display panel, comprising a base plate and a plurality of chip bearing films. The base plate is provided with a display area and a non-display area which is arranged on one side of the display area; wherein a plurality of wiring areas are arranged in the non-display area; a plurality of first pins and at least one first displacement survey mark are arranged in each of the wiring areas; the first displacement survey mark is arranged on at least one side of all the first pins. The chip bearing film is stuck correspondingly to the base plate; wherein each of the chip bearing films is provided with a second pin and a second displacement survey mark; the second displacement survey mark is arranged on at least one side of the second pin and corresponding to the first displacement survey mark; and the second pin is connected correspondingly with the first pin.

Description

technical field [0001] The present invention relates to a display panel, and in particular to a display panel capable of easily detecting the offset of bonded pins, a method for detecting pin bonding of a display panel, and a method for bonding pins of a display panel method. Background technique [0002] The components of a flat-panel display include a display panel, a light source for providing sufficient brightness for the display panel, and a driver chip disposed on the substrate of the display panel, wherein the driver chip is used to drive circuits inside the display panel so that the display panel can display images. [0003] Figure 1A is a schematic diagram of an existing display panel, while Figure 1B for Figure 1A A partial enlargement of the . Referring to FIG. 1 , in the display panel 100 , in the non-display area 110 a of the substrate 110 , there are a plurality of pad areas 120 , and each pad area 120 is configured with a plurality of pins 122 . These pi...

AI Technical Summary

Problems solved by technology

[0004] However, due to the material properties of the pins 122, 132, when the pins 132 of the driver chip are bonded with the pins 122 in the pad area 120 by thermocompression, the pins 122 will follow it in the pad area 120. The configuration position is different, but there is a problem of unstable quality due to shape expansion and contraction

This problem easily affects the bonding yield between the pins 132 of the driver chip 130 and the pins 122 in the pad area 120

When the bonding yield between the pins 132 of the driver chip 130 and the pins 122 on the substrate 110 is low, the display quality of the display panel 100 is easily affected.

In addition, the display panel 100 needs to be remade, which wastes manpower and hours of heavy work, and the production cost of the display panel 100 cannot be effectively reduced.

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